1.
Edge thinning based on robert operator in detection of ceramic substrates
陶瓷基片检测中Robert边缘细化算法
2.
STUDY ON THE CORDIERITE GREEN TAPES BY AQUEOUS TAPE CASTING
堇青石陶瓷基片水基流延成型工艺与性能研究
3.
Alumina ceramic substrates for thick film integrated circuits
GB/T14619-1993厚膜集成电路用氧化铝陶瓷基片
4.
Alumina ceramic substrates for thin film integrated circuits
GB/T14620-1993薄膜集成电路用氧化铝陶瓷基片
5.
dirll ,ultrasonic, for use with minerals or with ceramic substances for integrated circuits
超声钻孔机,用于矿物体或集成电路的陶瓷基片
6.
STUDY ON THE AQUEOUS TAPE CASTING FOR 99AL_2O_3 CERAMIC SUBSTRATE
99氧化铝陶瓷基片的水系流延成型研究
7.
cutting machine, ultrasonic, for working semiconductor chips or ceramic substrates for integrated circuits
超声切割机,用于加工集成电路的半导体晶片或陶瓷基片
8.
Tape Casting of Non-Aqueous LSGM Slip for It-SOFC and Study of Its Performence;
非水基流延法制备镓酸镧电解质陶瓷基片及性能研究
9.
Low Cost Preparation of Aluminum Nitride Ceramic Substrate by Carbothermal Reduction Nitridation;
氮化铝陶瓷基片碳热还原法低成本制备技术研究
10.
Mechanical Behavior Mechanisms of Al_2O_3/Al Multilayer Ceramics
Al_2O_3基片/Al层状陶瓷的力学行为机理
11.
Mechanical Properties of Al_2O_3/Al Multilayer Ceramics
Al_2O_3基片/Al层状陶瓷的力学性能研究
12.
Effect of Silica-based Ceramic Core on Non Core-basseted Rate of Hollow Blade
硅基陶瓷型芯性能对空心叶片不露芯率的影响
13.
A Coupled Electromechanical Analysis of an Axisymmetric Piezoelectric Ceramic Bonded to an Elastic Substrate;
弹性基体上轴对称压电陶瓷片的力电耦合分析
14.
round ceramic indexable insert
圆形陶瓷可转位刀片
15.
diamond-shape ceramic indexable insert
菱形陶瓷可转位刀片
16.
A Model of Thermal Stresses in a Ceramic/Cemented Carbide/Ceramic Sandwich Compound
陶瓷/硬质合金/陶瓷夹层复合片应力分析模型
17.
Effects of Cristobalite Content of Silica Base Ceramics Core on the Rate of Qualified Pouring
硅基陶瓷型芯方石英含量与叶片浇注不露芯率的关系
18.
Study of Borosilicate Glass/Alumina Substrate Material of Micro-Fuse;
片式陶瓷熔断器用硼硅酸盐/氧化铝基板材料的研究