1.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
2.
It will cause the paste oxidation and lose flux ratio balance if it is exposed for long-time.
锡膏与空气长时间接触后，会造成锡膏氧化、助焊剂比例成分失调。
3.
Research on precise alignment for full automatic solder paste printer
全自动视觉锡膏印刷机精密对准研究
4.
Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing
内置无铅锡膏印刷机的检测算法研究
5.
It involves the considerations of alloy content, tin powder particle and soldering flux type.
选择锡膏要考虑的因素包括合金含量，锡粉颗粒和助焊剂的因型。
6.
So it will result in rigidity skin &block and solder balls etc.
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。
7.
A: You should not have to change your stencil design to accommodate the change to lead-free.
您不需要为更换无铅锡膏而更改钢板设计。
8.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
9.
Similarly, the smooth aperture walls produced by electroforming also enhance paste release.
同理，电铸产生的光滑孔壁也有助于锡膏释放。
10.
Is the average and range of Solder Paste height measurements SPC controlled?
锡膏厚度测量的平均值和间距SPC是否受控?
11.
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
12.
The Pilot Preparation and Study on New Type Flux and Solder Paste;
新型助焊剂与焊锡膏的制备与研究初探
13.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
14.
Applications of Fieldbus Control System for the Integrated Circuit Board Paste Printer
集成电路板锡膏印刷机现场总线系统应用
15.
Research on structural optimization of the frame of high-accuracy solder paste printer
高精度锡膏印刷设备的机架结构优化研究
16.
Application of Hydroxy-alkyl-amine to Lead-free Solder Paste
烷基羟基胺在无铅焊锡膏制备中的应用
17.
The right choice of the most suitabele soldering paste is essential for an ideal and stable soldering result.
为了要达到理想又稳定的焊锡效果，选择合适的锡膏是决定性的因素。
18.
In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4).
在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。