1.
Excellent in solderability and high heat resistance with either flow or reflow soklering.
可焊性和耐焊性优，适用于流焊和再流焊。
2.
Test method of solderability for printed boards
GB/T4677.10-1984印制板可焊性测试方法
3.
Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance
GB/T17473.7-1998厚膜微电子技术用贵金属浆料测试方法可焊性、耐焊性试验
4.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
5.
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响
6.
Research on Feasibility of WB36 Steel Welding Process Using Domestic Welding Electrode
国产焊条焊接WB36钢的工艺可行性研究
7.
The welding technic on the rectifier diode connection for improving reliability.
元件板二极管的焊点采用熔焊技术，增加可靠性。
8.
Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;
SMT焊点的可靠性研究及CBGA焊点有限元分析
9.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
10.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
11.
Metals also possess the important property of being welsable
金属也具有可焊接的重要特性。
12.
A Few Measures for Increasing The Reliability of The Transistor Arc Welding Inverter
提高晶体管弧焊逆变器可靠性的措施
13.
Study on Welding Technology and Reliability of X80 Pipeline Steel;
X80管线钢焊接工艺及可靠性研究
14.
A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;
纳米银焊膏低温烧结粘接可靠性研究
15.
Research Status and Prospect for 80Au-20Sn Solder Joint Reliability
80Au-20Sn钎料焊点可靠性研究现状与展望
16.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
17.
Reliability analysis of PBGA soldered joints based on Taguchi method
基于田口法的PBGA器件焊点可靠性分析
18.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析