1.
Design for Frequency-modulated Ultrasonic Generator in Ultrasonic Bonding Field
超声键合变频式超声波发生器的设计
2.
Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;
超声键合界面微结构生成机理与规律研究
3.
Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System
热超声键合换能系统接触界面非线性振动研究
4.
Study on Interfacial Characteristics and Resistance of Electronic Device during Ultrasonic Bonding;
电子器件超声键合接合部形成特征及电性能研究
5.
Research on the Key Technologies of Ultrasonic-Magnetorheological Compound Finishing;
超声波磁流变复合抛光关键技术研究
6.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
7.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
8.
Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
聚合物微流控芯片超声波熔融键合技术研究
9.
Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips
聚合物微流控芯片超声波键合方法研究
10.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
11.
Several Questions in Spreading EDM Combined with Ultrasonic Machining;
推广超声—放电复合加工方法的几个关键问题
12.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响
13.
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在引线键合系统中的传播仿真与研究
14.
Fabrication of micro energy director on polymethyl methacrylate substrate for micro ultrasonic bonding
超声波键合能量引导微结构PMMA基片的制作(英文)
15.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
16.
Study on Key Techniques of CFRP Digital Ultrasonic Inspection System;
碳纤维复合材料数字化超声检测系统关键技术研究
17.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
18.
Design and Fabrication of Micro Energy Director on Microfluidic Chip for Ultrasonic Bonding;
微流控芯片超声波键合能量引导微结构设计与工艺