1.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
2.
Choice of Soldering Equipment in Electronic Assembly
电子组装中焊接设备的选择(续完)
3.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
4.
Large Area Hybrid--An Advanced Microelectronic Packaging Concept
大面积混合电路——一种先进的微电子组装概念
5.
Study on Long Term Reliabilty of ECA for Microelectronic Package;
微电子组装用导电胶长期可靠性的研究
6.
Analysis of Design of Mixed-Signal Electronic Packaging; Final rept. 15 Mar 1996-31 Dec 1998
关于混合信号电子组装设计的分析/最终报告
7.
Study on the Lead-Free Solder Paste Prepared by Mechanical Alloying in SMT;
电子组装膏状钎料机械合金化制备及研究
8.
The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;
微电子组装焊点可靠性及其铅污染问题的研究
9.
microelectronic modular assembly
微电子学微型组件装置
10.
packaging and construction of electronic equipment
电子设备组装与结构
11.
The Application of ROBOT Control Technology at the Assembly of Electronic Products
ROBOT控制技术在电子产品组装上的应用
12.
The Lift-on Scheme and Improvement of 600MW Generating Set Stator in Zhangjian Electric Plant;
湛江电厂600MW发电机组定子吊装方案及改进
13.
Preparation and Electrochemical Application of Supermolecule Self-assembled Modified Electrode
超分子自组装膜修饰电极的制备及电化学应用
14.
Selection of Hanging Plan for Generator Stator of 600MW Thermal Power Unit
600MW火电机组发电机定子吊装方案的选择
15.
Fabrication of Single Proton Exchange Membrane Fuel Cell and Conductivity Measurement of the Membrane Electrolyte
质子交换膜燃料电池单电池的组装及膜电解质电导率的测定
16.
A self-contained assembly of electronic components and circuitry, such as a stage in a computer, that is installed as a unit.
微型组件一组装在一起的电子元件或电路，作为一个单元被安装，如计算机中的一个装配步骤
17.
upside-down mounting
倒装法 -集成电路组装的
18.
(electronics) consisting of semiconductor materials and components and related devices.
（电子学）由半导体材料、成份和相关装置所组成的。