1.
A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;
纳米银焊膏低温烧结粘接可靠性研究
2.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
3.
Study of active substance for SnAgCu lead-free solder paste
SnAgCu无铅焊膏用活性物质研究
4.
MThoe mProecnestsu Cmon-ttryolp oef Printer
Momentum型印刷机的焊膏印刷工艺控制
5.
Application of SPC in Quality Control of Solder Paste Printing
SPC在焊膏印刷质量控制中的应用
6.
Effects of Rosin Resin on Properties of SnAgCu Solder Paste
松香树脂对SnAgCu焊膏性能的影响
7.
Viscosity-A Key Factor for Quality Control in Solder Paste Printing
黏度——决定焊膏印刷质量的关键因素
8.
Solvent may be easily vaporized when solder paste is contacted with air-conditioned current or wind and hence reducing its tackiness.
不要将焊膏放近于风口的位置，因为这样会使焊膏中的溶剂蒸发，降低其粘性。
9.
The Synthesis of the New Activator and Applied in the Lead-free Solder Paste
新型活化剂的合成及在无铅焊膏产品上的应用
10.
Development of Brazing Grease for Stainless Steel-Aluminum in High Frequency Induction Brazing;
不锈钢—铝高频感应钎焊膏状钎料的研制
11.
The Study Based on Characteristics of Stencil Opening Hole in the Solder Paste Deposition Process;
基于模板特性影响焊膏印刷落锡量过程控制研究
12.
All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.
我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。
13.
The Investigation of Analysis Method for Import Flux;
1 进口焊膏中助焊剂的剖析方法研究 2 卡尔费休库仑法测定SF_6中痕量水
14.
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
15.
The Pilot Preparation and Study on New Type Flux and Solder Paste;
新型助焊剂与焊锡膏的制备与研究初探
16.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
17.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
18.
It will cause the paste oxidation and lose flux ratio balance if it is exposed for long-time.
锡膏与空气长时间接触后，会造成锡膏氧化、助焊剂比例成分失调。