1.
Multiphase Field Numerical Simulation of Lamellar Growth in Binary Eutectic Alloys;
二元共晶层片生长的多相场法数值模拟
2.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
3.
EFFECT OF TWIN LAMELLAR THICKNESS ON THE FATIGUE PROPERTIES OF NANO-TWINNED Cu
孪晶片层厚度对纳米孪晶Cu疲劳性能的影响
4.
The transparence of the glaze depends on whether there is a separated-crystal layer in the glaze.
瓷片的透明度与釉中析晶层密切相关。
5.
TiAl Seed Preparation & Fully Lamellar Structure Control Through Seeding and Directional Solidification;
TiAl籽晶制备及定向全片层组织的研究
6.
The CBFS series is a3 terminal EMI Suppressor Filter based on multilayer chip capacitor technology.
CBF系列的晶片系以积层晶片电容科技为基础之三端子滤波器.
7.
Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing
单晶硅线锯切片亚表层损伤层厚度预测与测量
8.
Influence of Magnetic Field on Lamellar Eutectic of Pb-Sn Alloy
磁场对Pb-Sn合金层状共晶生长的影响
9.
An investigation of the lamellar-rod transition in binary eutectic using multi-phase field model
共晶形态层—棒转变的多相场法研究
10.
Effects of Grain Size and Lamellar Thickness on Yield Strength of Fully Lamellar γ-TiAl Based Alloys
晶粒尺寸和片层厚度对全片层γ-TiAl基合金屈服强度的影响
11.
Depletion Layer- A region on a wafer that contains an electrical field that sweeps out charge carriers.
耗尽层-晶圆片上的电场区域，此区域排除载流子。
12.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
13.
Influences of Long Alkane Chain Quaternary Ammonium Salts on the Structure of Layers in OMMT
长烷烃链季铵盐对OMMT晶片层间结构的影响
14.
Mechanical Properties and Lamination Factors of SI-ORIENT-CORE-HI-B and SI-ORIENT-CORE Grain Orient Electrical Steel Sheets
晶粒取向电器用硅[硅]钢片-高硼定取向芯钢片及定取向芯钢片之机械性能及夹层系数
15.
In true exfoliation, the superficial lamella of the anterior lens capsule becomes loosened and peels off in a large scroll.
在前者，可见到水晶体前囊的表层大片地剥离而漂浮于前房液中。
16.
Lamination Factors of Electrical, Magnetic & Mechanical Non-Grain Oriented Electrical
非晶粒取向电力用钢片的电力、磁力、机械性能及夹层系数
17.
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
18.
Co-precipitation of nano-crystalline corrosion products on hot dip Zn-Al alloy coating
热浸锌铝合金镀层表面纳米晶腐蚀产物共沉积机理