1.
Study on the Preparation of Zinc Oxide and Tin Dioxide Nanoparticles;
纳米氧化锌和氧化锡粒子的制备研究
2.
Preparation of SnO)2 Nanoparticles by a Silica Gel Template;
以硅胶为模板制备二氧化锡纳米粒子
3.
It involves the considerations of alloy content, tin powder particle and soldering flux type.
选择锡膏要考虑的因素包括合金含量，锡粉颗粒和助焊剂的因型。
4.
Preparation and Lithium Storage Properties of Sn-based Compound Nanoparticles;
锡基金属间化合物纳米粒子的制备及储锂性能
5.
Retrospective analysis of Mr.Xie Xiliang's medical records that had treated hepatitis B with direct-moxibustion for 30 years
谢锡亮先生麦粒灸治疗乙肝30年医案回顾分析
6.
Test and Application of Sawtooth Wave Jigger for Recovering Fine Cassiterite
锯齿波跳汰机回收细粒级锡矿石的试验与应用
7.
STUDIES ON THE MECHANISM OF MARINE FOULING PREVENTION WITH ORGANOTIN COMPOUNDS Ⅰ. THE EFFECT OF TRIPHENYLTIN CHLORIDE ON THE MITOCHONDRIA IN CIRRI MUSCLE OF BALANUS AMPHITRITE AMPHITRITE DARWIN
有机锡对海洋附着生物的防污机理研究——Ⅰ.三苯基氯化锡对藤壶线粒体的影响
8.
Powder produced in this way has a uniform particle size distribution, low oxide content and high purity.
这种方法制造出来的焊锡粉具统一的粒径、氧化和高纯度的特性。
9.
If granulated tin is used the reaction may have to be initiated by careful warming.
如果所用的是粒状锡，那么须靠小心加温来引起反应。
10.
The Preparation of MPc/SnO_2 and the Properties on Its Liquid-solid, Gas-solid Interface;
金属酞菁/二氧化锡复合粒子的制备及其固—液、固—气界面性能的研究
11.
Study on the Preparation and Properties of Undoped and Doped SnO_2 Nanometre Particles;
掺杂及未掺杂二氧化锡纳米微粒的制备及性能研究
12.
The Preparation and Energy Storage Properties of Mg/Sn-based Intermetallic Compound Nanoparticles;
镁、锡基金属间化合物纳米颗粒的制备及储能特性的研究
13.
Electrochemical Fabrication of Nanoparticles and Three Dimensional Micro-nano Structures of Tin, Lead Metals and Oxides
锡、铅金属和氧化物纳米粒子与三维微纳结构的电化学制备
14.
Effect of inner diameter of delivery tube end of atomizer on morphology and size distribution of free-lead solder powder
雾化器导液管内径对无铅焊锡粉末形貌及粒度分布的影响
15.
Synthesis and Surface Plasmonic Resonance of Stannum Nanocaps
帽状锡纳米粒子的制备及其表面等离子的共振特性
16.
Of, containing, or yielding tin.
锡的含锡的或产锡的
17.
Of, relating to, or made of tin.
锡制的锡的，与锡有关的或由锡制成的
18.
Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.
下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。