1.
epoxy pouring sealant for high-voltage focusing potentiometer
高压聚焦电位器环氧灌封胶
2.
Application of Silicone to Epoxy Encapsulating Materals and Potting Compound
有机硅在环氧包封料、灌封料中的应用
3.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
4.
Preparation and Characterization of Lightweight and Higher Resistance to Impact Epoxy Encapsulating Materials
轻质抗冲击环氧灌封材料的制备与表征
5.
Study on curing reaction kinetics and properties of epoxy potting compound
环氧灌封料固化反应动力学及其性能研究
6.
The influence of filler on the properties of epoxy encapsulating materials
硅微粉填料对环氧灌封材料性能的影响
7.
Preparation and characterization of epoxy encapsulating materials toughened by polyurethane
聚氨酯增韧环氧灌封材料的制备与表征
8.
Study on property modification with nanometric particles for epoxy adhesive agent used to coat the fiber Bragg gratings
用于光纤光栅封装的环氧胶粘剂纳米改性研究
9.
A Composite Thermal Conductive Insulating Epoxy Adhesive Material for Electronic Package
电子封装用复合导热绝缘环氧胶粘剂的研制
10.
Properties of Polyurethane-Modified Epoxy Resin Encapsulating Materials Filled with Glass Fiber
玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能
11.
Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2/epoxy resin
纳米SiO_2/环氧树脂灌封材料的制备和力学性能研究
12.
Effect of Grafted Particles PGMA/Al_2O_3 on Toughness and Reinforce of Encapsulating Materials of Epoxy Resin
接枝微粒PGMA/Al_2O_3对环氧树脂电子灌封材料的增强增韧作用
13.
Studies on the Sealant Using Expoxy Modified Arylic Resin and Nano-SiO_2 Composite Material;
密封胶用环氧改性丙烯酸树脂及纳米复合材料的工艺研究
14.
Epoxy Impregnating Resin with Low Viscosity and High Resistance to High and Low Temperature Shock for Miniature Electronic Components
小型电子元件用低粘度耐高低温环氧灌注胶的研究
15.
epoxy enclosed mica capacitor
环氧包封云母电容器
16.
epoxy seal transistor
环氧树脂封装晶体管
17.
epoxy enclosed transistor
环氧树脂密封晶体管
18.
a Buna-N cable grommet or a strain relief fitting shall be provided in addition to the epoxy sealed leads.
除此之外,还应该配置丁纳橡胶-N电缆索环或应变消除接头,进一步强化环氧树脂密封接头。