1.
Study on Surface Quality and Material Removal Rate of Wafer Ultra-precision Grinding;
硅片超精密磨削表面质量和材料去除率的研究
2.
(2)Only depth of cut and federate have effects on material removal rate (MRR).
(2)仅当切削深度、进给速度等参数值增加时，材料去除率增加；
3.
Analysis on Hydrodynamics and Material Removal Rate of Circular Translational CMP;
圆平动化学机械抛光的流体动力性能及材料去除率研究
4.
Analysis of Influencing Factors of Sapphire Substrate CMP Removal Rate
蓝宝石衬底材料CMP去除速率的影响因素
5.
cutting power per unit material removal rate
单位材料切除率的切削功率
6.
"Remove the plastic wrapping, adhesive tape and Styrofoam from the balance."
去除塑料薄膜、胶带和泡沫材料
7.
Detection of Subsurface Damage and Material Removal Mechanism in Optical Polishing Process
光学材料抛光亚表面损伤检测及材料去除机理
8.
Study on material removal theoretical model of zone polishing technology
环带抛光技术材料去除理论模型研究
9.
Two-dimension Modelling for Material Removal of Magneto-rheological Finishing
磁流变光整加工材料去除的二维建模
10.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
11.
Three-dimensional Material Removal Model of Magnetorheological Finishing(MRF)
磁流变抛光过程的材料去除三维模型
12.
A theoretical model to estimate the material removal rate has been developed.
现已成功研制一个估算材料切除率理论模型。
13.
The opposing magnetic intensity that must be applied to a magnetized material to remove the residual magnetism.
作用于磁化材料以去除剩磁的反向磁通强度。
14.
a medallion with a profile cut in raised relief.
用去除材料法切割出轮廓线的圆形浮雕.
15.
Research of Nano-zeolite Composite as Adsorbent for the Removal of Benzene Hydrocarbons in Water;
纳米分子筛复合材料去除水中苯系物的研究
16.
Research on the Structure Changing of the SiCp/ZL101A Vibration Brazing Bond;
SiCp/ZL101A复合材料振动钎焊缺陷去除工艺研究
17.
Study on Material Removal Mechanism for Non-contact CMP;
非接触化学机械抛光的材料去除机理研究
18.
Research on the Material Removal Mechanism of Semi-Fixed Abrasive Tool
基于半固着磨粒磨具加工的材料去除机理研究