1.
Study on (Sr, Ca) TiO_3 Ceramic Substrate Prepared by Aqueous Tape Casting
水基流延法制备钛酸锶钙陶瓷基板的研究
2.
STUDY ON THE AQUEOUS TAPE CASTING FOR (Sr,Ca) TiO_3 CERAMIC SUBSTRATE
水基流延法制备(Sr,Ca)TiO_3陶瓷基板的研究
3.
Electroless Plating Technology of High Precision Ceramic Substrate
高精度陶瓷基板化学镀多层膜技术研究
4.
Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material
AlN陶瓷基板材料热导率与烧结助剂的研究进展
5.
A plurality of ceramic substrates are used to manufacture and integrate a highly integrated multi-layer circuit module.
复数个陶瓷基板被用来制造和整合一高整合多层电路模组。
6.
Fabrication Technics and Properties of Black Alumina Substrates Prepared by Tape Casting;
流延法制备黑色氧化铝陶瓷基板工艺及其性能研究
7.
Fabrication of Nano-porous SiC-based Ceramics Using Template Method;
模板法制备SiC基陶瓷纳米孔结构材料
8.
Preparation and Properties of Glass Ceramic Materials for LTCC
LTCC基板用玻璃陶瓷材料的制备及性能
9.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
10.
Wettability of Al/Al_2O_3 system and direct aluminum bonded substrates
铝和氧化铝的润湿性及氧化铝陶瓷敷铝基板
11.
finger-plate, ceramic, for windows and doors
门窗防污板,陶瓷制
12.
The Beijing dingshun involves many domains along the base industry service domain: Real estate, ceramics, lumber, steel products, Shi Cai, plate and so on.
北京鼎顺基业业务领域涉及多个领域：房产、陶瓷、木材、钢材、石材、板材。
13.
Fabrication and Properties of Large-scaled Ba_(1-x)Sr_xTiO_3 Based Ferroelectric Ceramic Sheet;
大尺寸Ba_（1-x）Sr_xTiO_3基铁电陶瓷薄板的制备与性能研究
14.
Study of Borosilicate Glass/Alumina Substrate Material of Micro-Fuse;
片式陶瓷熔断器用硼硅酸盐/氧化铝基板材料的研究
15.
Preparation of Low Loss Tangent AlN Ceramics and BN-AlN Composites
低介电损耗AlN陶瓷及BN-AlN基陶瓷材料研究
16.
Research and Development of Toughening of Ceramic Matrix Composites by Piezoelectric Ceramic Particles
压电陶瓷颗粒增韧陶瓷基复合材料研究进展
17.
Research of Metal-Based Namo-ceramic Coating Technology;
纳米陶瓷—金属基体衬瓷技术的研究
18.
connection strip, electric, ceramic, not fitted with their terminals
陶瓷电线接头条板,未接接头