2) dual rotating plates lapping mode
双自转研磨盘研磨方式
1.
Through simulation analysis on lapping uniformity of ceramic balls under the dual rotating plates lapping mode,it can be indicated that the lapping uniformity not only depends on the variation range of spin angle θ,but also is determined by the(variation) form of θ and the spin angle speed of ball ω_(b).
对陶瓷球在双自转研磨盘研磨方式下的研磨均匀性进行仿真分析,表明研磨均匀性不仅取决于自旋角θ变化范围,而且取决于θ角的变化过程和球的自转角速度ωb的变化。
3) dual rotation plates lapping method
双自转研磨盘研磨
4) double-side lapping
双面研磨
1.
The dissertation was summarized home and abroad the glass substrate development present situation and the being problem , Elaborate double-side lapping process mechanism ?A two-step crystallized technology for crystallite glass is put forward in the pa.
本文概述了国内外玻璃基板发展的现状和存在的问题，阐述了双面研磨的加工机理。
5) auto-polish
自动研磨
1.
A research of auto-polishing free curve surface of molds based on self-designed device is brought forward in the thesis,which is made up of control system and perform framework.
设计了一种用于模具自由曲面自动研磨加工的实验装置,由控制系统和执行机构组成,该装置安装在加工中心主轴上,研磨路径由加工中心控制。
2.
In order to solve the problem of removing uneven and improve processing quality in mold process,a variety-Rev auto-polishing free curve surface of molds based on fuzzy control is studied.
为了解决模具曲面研磨中去除量不均的难题,提高自动研磨模具曲面的加工质量,设计了一种用于模具自由曲面自动研磨加工的实验装置,在优化加工工艺参数的基础上,提出了基于模糊控制的变转速自动研磨自由曲面的设计方法,通过转速仿真和实验研究,证明该方法能够满足自动化研磨加工的要求。
6) double surface lapping machine
双面研磨机
补充资料：磨盘
研磨盘是半导体行业中超大规模集成电路用硅片生产的重要工艺装备。通常使用的铸铁或碳钢研磨盘其使用寿命低，热膨胀系数大。在加工硅片过程中，特别是高速研磨或抛光时，由于研磨盘的磨损和热变形，使硅片的平面度和平行度难以保证。采用碳化硅陶瓷的研磨盘由于硬度高研磨盘的磨损小，且热膨胀系数与硅片基本相同因而可以高速研磨、抛光。特别是近几年来的硅片尺寸越来越大，对硅片研磨的质量和效率提出了更高的要求。碳化硅陶瓷研磨盘的使用将使硅片研磨的质量和效率有很大的提高。同时碳化硅陶瓷研磨盘还可用于研磨、抛光其它材料的片状或块状物体的平面。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条