The experiment results show that using a small amount of nano-particles SiO2,Al2O3 and ZnO can apparently improve the moisture absorption property of underfiller,and particularly,the lowest percentage of moisture absorption can be obtained by filling 3%(by mass) ZnO nano-particles.

Managing Transient Thermal Environments During the Underfill Process

It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill,so it is very important for electronic packaging.

The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.

Considering the stone quarry environment was complicated,the initiation plan of triangular drilling and diagonal detonation were employed;By choosing reasonable millisecond blasting time and clogged length to effectively control the blasting vibration and flying rocks;the technology of vacuum space blasting was adopted to improve the effect of blasting and leave no bedrock.

The methods and skills of the CorelDRAW X4 texture filling tool for drawing cabochon or bead gemstones,wire and sandblasted effect of metal texture are introduced in detail.

Influence of cemented filling on stope stability;

Cemented filling with phosphorus gypsum from Kaiyang Phosphorus Group Co,Ltd not only reduced storage of phosphorus gypsum on ground surface in mining area,but also provided a condition for pillars recovery.

The results show that the tailings from Tongshan Copper Mine and sand from the Yangtse River are capable to apply to cemented filling accompanied with the 425 cement.