1) thermally conductive insulating
导热绝缘
1.
Study on preparation and properties of Nano-AlN/EP thermally conductive insulating adhesive
纳米AlN/EP导热绝缘胶的制备及其性能研究
2) insulating heat conduction
绝缘导热
1.
This paper mainly described the research on rheological property,high thermal stability,flame retardant,the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials,which greatly apply on electronic equipment and large scale integrated circuit and so forth.
本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。
3) Thermal Conductive Insulating Plastics
导热绝缘塑料
4) high heat conduction main insulation
高导热主绝缘
1.
The importance of high heat conduction main insulation materials in the development of modern electric motor technology was stated.
介绍了高导热主绝缘材料在现代电机技术发展中的重要意义及国内现状和动态,并提出几点个人看法和建议。
5) thermal conductive electrical insulating materials
高导热绝缘材料
6) thermal conductive and insulating paste
导热绝缘浆料
补充资料：导热
分子式：
CAS号：
性质：见热传导
CAS号：
性质：见热传导
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条