1) Failure circuit
失效电路
3) IC failure
集成电路失效
1.
This thesis narrates some causes of IC failure in detail ,which including :wrong selection of capillary ,chip’s surface pollution in production, aluminum lift , erroneous bonding parameters ,defective epoxy molding compound (EMC), moist stored circumstance and so forth .
文章主要对集成电路失效问题进行分析,列举出了容易引起集成电路失效的原因:压焊劈刀选型不当,生产过程中造成芯片表面沾污,芯片表面内压焊点铝层与底层硅化合物结合不牢,选用压焊参数不当,环氧塑封料的特性不佳,存储环境恶劣导致成品电路吸潮等,并逐一进行了分析。
2.
This thesis narrates some causes of IC failure in detail ,which include :wrong selection of capillary ,staining die’s surface , aluminum lift ,erroneous bonding parameters ,defective epoxy molding compound (EMC), moist stored circumstance and so forth .
文章主要对集成电路失效问题进行了分析和阐述。
4) FAULT MONITORING CIRCUIT
失效监控电路
5) Shutting failure
分路失效
6) resistors
开路失效
1.
Analysis of open circuit failure of chip resistors.;
厚膜片状电阻器开路失效分析
补充资料：失效
失效
物质失去（指某一制品）效力或原作用，如过期和保存不善使药物失效。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条