1) via holes array
通孔阵列
1.
To integrate MMIC chips into LTCC substrates,a passive structure of the LNA including bonding wires,via holes array and multilayer ground planes is designed and optimized using 3D full-wave electromagnetic software,the bonding wires are used for interconnection from MMIC chips to microstrip lines and the via holes array are used for grounding between different ground planes.
将低噪声放大器的MMIC芯片集成于LTCC基板中,利用三维全波电磁场软件设计和优化了LNA的无源模型,包括金丝、通孔阵列和多层地平面。
2) macropore array
大孔深通道阵列
3) array holes
阵列孔
1.
Then micro array holes are processed respectively by EDM and ECM.
用微细电火花线切割机加工出3×3至10×10系列方形阵列电极,宽度在25~90μm,加工中采用降低加工电压、加工电流、进给速度和减小工作液冲击等方法,获得了质量较好的阵列电极,并分别利用微细电化学加工和微细电火花加工两种工艺方法进行阵列孔加工。
2.
The structure of micro array holes is widespreadly applied in industries.
微细阵列孔结构在工业中有着广泛的应用,其加工方法有超声加工、电解加工、激光加工、电子束加工及电火花加工等。
3.
In industry realm of aviation aerospace, electronics, optic fiber and transact automation equipments, picture display, medical treatment apparatus, liquid press component, more and more mirco- array holes are used as the key structure of accessory, diameter of array holes is more and more small and the accurac.
在航空航天、电子、光导纤维以及办公自动化设备、图像显示器、医疗器械、液压元件等工业领域中,以阵列微小型孔为关键结构的零部件的使用越来越频繁,孔径尺寸越来越小,精度要求越来越高,例如光纤连接器、化纤喷丝板、电子显微镜光栅、打印机喷墨孔阵列,以及微喷嘴、微泵中的阵列孔微细结构等。
4) machining arrayed drills
阵列钻孔
5) deep macropore array
深孔列阵
6) pores array
孔洞阵列
补充资料：深通
1.精通。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条