2) Flow Drawbacks
流动缺陷
3) defect movement
缺陷移动
1.
Such resistivity is caused by the lack of oxygen in the central segment, impurity migration, and defect movement in the course of sintering and cooling.
电阻率的这种分布是由于在样品烧结过程中,中心部位缺氧,表层富氧;冷却时杂质向表层迁移,缺陷移动所致。
4) chasmic activities
裂陷活动
1.
Shelincuo and Bangecuo extensional lake basins in the northern pa rt of Tibet and present chasmic activities;
藏北地区色林错、班戈错湖盆扩张及现代裂陷活动
5) defect dynamics
缺陷动力学
6) Promoter-deficient
启动子缺陷
补充资料：点缺陷(见晶体缺陷)
点缺陷(见晶体缺陷)
point defect
点缺陷point defeet见晶体缺陷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条