1) bismaleimide-triazine resin(BT resin)
双马来酰亚胺-三嗪树脂(BT树脂)
3) maleimide resin
马来酰亚胺树脂
1.
Using epoxy-acrylate prepolymer,maleimide resin and aluminium silicate as the heat resistant ingredients of adhesive,the paper studied the effects of the ingredients on the heat resistance of acrylate structural adhesive.
考查了环氧丙烯酸酯预聚体、马来酰亚胺树脂、硅酸铝等3种不同类型耐热材料,对丙烯酸酯胶粘剂耐热性能的影响。
2.
The thermal stability of the new polymaleimide resin bas been studied by TG method.
采用热重分析（ＴＧ）测试方法对新型马来酰亚胺树脂的耐热性进行了研究。
4) bismaleimide resin
双马来酰亚胺树脂
1.
Progress of bismaleimide resin used for PCB laminate;
双马来酰亚胺树脂在印制电路板中的应用进展
2.
Research progress of bismaleimide resin modified by allyl compounds
烯丙基化合物改性双马来酰亚胺树脂的研究进展
3.
The basic principle of the toughening and modifying on bismaleimide resin was introduced, the characteristics and the modifying effects of the toughening and modifying with thermoplastic resin, the combination of aromatic diamine and epoxy resin, organic silicone, allyl compounds, cyanate ester resin, the blends of three-dimensional braided carbon and Kevlar fabrics and so on were discussed.
介绍双马来酰亚胺树脂(BMI)增韧改性的基本原理,论述了热塑性树脂增韧改性、芳香族二胺和环氧树脂相结合增韧改性、有机硅增韧改性、烯丙基系列化合物增韧改性、氰酸酯树脂增韧改性、三维编织碳纤维和凯夫拉纤维混合增韧改性等方法的特点与改性效果。
5) BMI resin
双马来酰亚胺树脂
1.
The gelation process of BMI resin system was investigated by gelation disk,and the relationship between gel-time vs temperature was obtained.
采用全动态DSC研究了双马来酰亚胺树脂(BMI)体系的固化反应动力学,建立了固化动力学的唯象模型。
2.
Effects of BMI/DBA ratio on morphologies of BMI/DBA/PEI blends and on diameters and distributions of BMI resin microspheres were studied in this paper.
考察了双马来酰亚胺树脂(BMI)/二烯丙基双酚A(DBA)质量比对BMI/DBA/聚醚酰亚胺(PEI)共混体系固化物相结构以及BMI树脂微球的影响。
6) BMI
双马来酰亚胺树脂
1.
BMI Resin System and Affordable Composite;
QY8911双马来酰亚胺树脂和复合材料低成本
2.
Quartz fibre strengthen Bis maleimide BMI composite material have low to dielectric loss angle, able to bear high temperature, damp and hot, good mechanics performance.
石英纤维增强双马来酰亚胺树脂复合材料具有低介电损耗、耐高温、耐湿热及良好的力学性能。
3.
The cure kinetic model and kinetic parameters of BMI resin for RTM are studied by DSC.
采用DSC方法研究RTM专用双马来酰亚胺树脂的固化动力学模型与固化动力学参数。
补充资料：双马来酰亚胺
CAS: 13676-54-5
分子式: C21H14N2O4
分子量: 358.35
熔点: 155-159℃
中文名称: 双马来酰亚胺；1,1'-(亚甲基二-4,1-亚苯基)二(1H-吡咯-2,5-二酮)
英文名称: 5-dione, 1,1'-(methylenedi-4,1-phenylene)bis-1H-Pyrrole-2；Bismaleimide, 4,4'-diphenylmethane；4,4'-Diphenylmethanebismaleimide；n,n'-(methylenedi-p-phenylene)di-maleimid；1,1'-(methylenedi-4,1-phenylene)bis-1h-pyrrole-5-dione；4,4'-biphenylmethanebismaleimide；4,4'-dimaleimidophenylmethane；4,4'-diphenylmethanedimaleimide；4,4'-methylenebis(phenylmaleimide)
分子式: C21H14N2O4
分子量: 358.35
熔点: 155-159℃
中文名称: 双马来酰亚胺；1,1'-(亚甲基二-4,1-亚苯基)二(1H-吡咯-2,5-二酮)
英文名称: 5-dione, 1,1'-(methylenedi-4,1-phenylene)bis-1H-Pyrrole-2；Bismaleimide, 4,4'-diphenylmethane；4,4'-Diphenylmethanebismaleimide；n,n'-(methylenedi-p-phenylene)di-maleimid；1,1'-(methylenedi-4,1-phenylene)bis-1h-pyrrole-5-dione；4,4'-biphenylmethanebismaleimide；4,4'-dimaleimidophenylmethane；4,4'-diphenylmethanedimaleimide；4,4'-methylenebis(phenylmaleimide)
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参考词条