1) wafer warping
圆片翘曲
1.
When wafers in 150mm,200mm,or even 300mm are grinded to less than 150μm,the problem of wafer warping and edge damage becomes very obvious.
随着微电子工业迅猛发展,圆片直径越来越大,当150mm、200mm甚至300mm英寸圆片被减薄到150μm以下时,圆片翘曲和边缘损伤问题变得尤为突出。
2) warped blade
翘曲叶片
3) warped plate
变形板，翘曲盘[片]
4) double sheet metal style warp
双金属片式翘曲
1.
Aiming at temperature excursion in test,the double sheet metal style warp is approved to be the main factor by analysis,experiment and simulation.
变栅距光栅线位移传感器工程样机完成后,进行了常态性能试验及环境试验,针对试验中出现的温度漂移问题,通过理论分析、试验验证、软件仿真,证实光栅组件的双金属片式翘曲为产生温漂问题的主要原因,并利用ANSYS-Workbench模拟得到解决方案,通过改进后的筒状腔体结构,使得温漂量值从12nm降到2nm以内。
5) warp
[英][wɔ:p] [美][wɔrp]
翘曲
1.
Cause Analysis of Tinplate Warp and Our Countermeasures;
宝钢镀锡板翘曲原因分析与对策
2.
Investigation on warp and curl in selective laser sintering polymeric materials;
高分子材料选区激光烧结翘曲的研究
3.
Solving the Problem of Warping in the Injection Moulding Parts through Computer-Aided-Engineering Technology;
利用CAE技术解决注塑件的翘曲问题
6) warpage
['wɔ:peidʒ]
翘曲
1.
An integrated simulation of residual stress and warpage for plastic injection molding;
塑料注射成型应力与翘曲的集成模拟
2.
Analysis of Warpage of Thin-walled Plastic Parts by CAE;
薄壁件翘曲变形CAE分析
3.
Nonlinear finite element analysis on electronic chip package warpage;
芯片电子封装翘曲非线性有限元分析
补充资料：双金
1."双南金"的略语。优质黄金。 2.喻指优秀的两篇诗文或两个人。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条