1) IC manufacturing
IC制造
1.
IC manufacturing faced the challenges of physical limits,3D packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天,3D封装技术越来越成为了微电子行业关注的热点。
3) IC Manufacturing Equipment
IC制造设备
1.
Some key parts of IC Manufacturing Equipment have critical requirement on their roughness of interior and exterior surfaces, which is too difficult to be met by the traditional millering and polishing methods, resulting in the blocking of the localization of such equipments.
IC制造设备中的关键零部件对于其内外表面粗糙度有着很高的要求。
5) IC controlling electric circuit
IC控制电路
6) integrated circuit of controlling phase
相位控制用IC
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条