1) printed scrap circuit board
废印制线路板
1.
Separation of vacuum pyrolysis residue from printed scrap circuit board and residue composition determination
废印制线路板真空热解渣分选与组成分析的研究
2) wastewater of printed circuit board
印制线路板废水
1.
The engineering practices show that water quality from wastewater of printed circuit board after treatment by applying the technology course meets the first grade standard (DB44/26-2001) .
文章介绍了某企业的印制线路板废水处理工艺技术。
3) printed circuit boards scrap
废弃印刷线路板
1.
Progress of recycling printed circuit boards scrap by pyrolysis;
废弃印刷线路板热解回收研究进展
2.
The determination of Pb,Cd and Cr content in printed circuit boards scrap by flame atomic absorption spectrometry is investigated.
研究用原子吸收分光光度计测定废弃印刷线路板中重金属元素Pb,Cd和Cr的含量。
4) waste printed circuit board
废旧印刷线路板
1.
The paper reviews the composition of waste printed circuit board, the current available recycling technologies including incineration, acidic recycling, and mechanic recycling with an emphasis on the last one.
本文较全面地介绍了废旧印刷线路板的组成、成分、目前常用的资源化技术如火法、湿法、机械处理,并分析了不同技术的优缺点。
2.
In this paper, four type of methods for waste printed circuit board reutilization are analyzed and compared.
分析了废旧印刷线路板的再资源化技术现状和问题,在此基础上,自主开发了一套经济、绿色的线路板物理回收方法。
5) waste printed circuit boards
废印刷线路板
1.
Measurement of pyrolysis contamination during crushing of waste printed circuit boards;
废印刷线路板粉碎处理中热解污染的试验研究
6) Waste Printed Circuit Board
废弃印刷线路板
1.
Electrodepositing gold of iodine leaching solution from waste printed circuit board
电解法从废弃印刷线路板的碘化浸金液中沉积金
2.
The design of technical process for recovery of gold from waste printed circuit board(PCB) by iodine leaching process was investigated.
针对碘化法从废弃印刷线路板中提取金的工艺设计,分别考察了碘的质量分数、n(I2)/n(I-)比值、固液比、双氧水的质量分数、pH值、浸出时间和浸出温度对金浸出率的影响。
补充资料：印制线路板
| 印制线路板 printed wiring board 在绝缘基板上用印制手段制出导体图形，构成电气互连的线路。早期的电子设备，电子和机电元器件装在金属薄板制成的底盘上，用导线实现电气互连。第二次世界大战后，随着印制线路技术的发展，把电子和机电元器件装在印制线路板上构成一个部件，电子设备特别是电子计算机，逐渐形成了以这种部件为基础的结构体系。其优点是电性能好、可靠性高、体积小、成本低，并可实现自动化生产。板上导体图形印制手段一般可分为减成法（蚀刻法）和加成法。减成法是在覆铜箔的绝缘基板上蚀刻去掉不需要的铜箔形成导体图形；加成法是在绝缘基板上用化学沉积或用与化学沉积相结合的其它手段形成导体图形。印制线路板按层数可分为：①单面板：在板的一面有印制导体图形。②双面板：在板的两面有印制导体图形。③多层板：在板的3层和3层以上有印制导体图形，层间以绝缘材料粘合，并用金属化孔完成层间电气互连，层数多少标志互连密度的高低。大型计算机和电子系统常采用多层板（有高达30层以上的），一般电子设备采用单面或双面板。印制线路板技术发展趋向将和现代电子设备的微电子组装技术相结合。 |
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条