1) integration and packaging
集成与封装
1.
Finally, this thesis gives a general introduction to the integration and packaging of monolithic microwave micro-plasma source, including block diagram and packaging technology.
最后,本论文对基于MSRR的微波微等离子体源的集成与封装做了一个总体的介绍,包括集成框图和封装工艺,并且给出了等离子体激发以后谐振器反射系数的仿真结果。
2) Tool encapsulation and integration
工具封装与集成
3) 3D Integration and Packaging
三维集成与封装
4) encapsulation and integration
封装和集成
1.
In order to implement the integration and application of legacy hardware/software manufacturing resources in manufacturing enterprises, a scheme and a framework for the manufacturing resource encapsulation and integration are introduced.
针对制造企业的传统软硬件制造资源的集成和应用问题 ,提出一种基于移动Agent技术的资源封装和集成方案及框架 ,实现了在统一的Web浏览器界面下 ,通过启动不同的封装模板 ,实现对传统软硬件资源的重构和封装、信息交互和获取及协同工作等功能 ,以达到网络化制造系统对传统软硬件制造资源集成和控制的目的。
5) IC package
集成电路封装
1.
Based on the progress of technology in IC and the development of IC package,the key steps of IC package,as well as the rules of developing are found out by means of consideration of internal and external factors.
本文结合了集成电路技术的进步 ,通过对集成电路封装发展的探索 ,找出了其中的关键步骤 ,提出了发展中的内外因素 ,摸索其规律 ,并作出了封装今后发展趋势的设
6) encapsulating module integration
封装组件集成
1.
Then,the conclusion is received through analyzing and comparing the different integration method,which the encapsulating module integration method is the most applied and effectual method.
从集成内容和集成方式论述CAPP与PDM的集成,并对不同的集成方式进行了分析和比较,得出结论封装组件集成方式是一种最实用和高效的集成方式。
补充资料：集成
同类著作汇集在一起（多用做书名）：《丛书～》ㄧ《中国古典戏曲论著～》。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条