1) chemical dispersion plating
化学弥散镀
2) dispersion plating
弥散镀
3) dispersion science
弥散科学
5) Dispersion strengthened
弥散强化
1.
The development state,manufacture technology,microstructure and properties,application of oxide dispersion strengthened copper alloys are generally reviewed.
简要概述了氧化物弥散强化铜合金的发展状况、制备方法、组织和性能特点以及应用前景。
2.
So, in this paper, a new method of making dispersion strengthened copper matrix composites is tried to resolve the present problems.
弥散强化铜基复合材料以其优异的性能而有着广泛的应用前景。
3.
The article aim at developing a kind of copper alloy material with high strength and good electric conductivity-dispersion strengthened copper alloy.
本文的目的在于采用机械合金化的方法研制一种高强度、高导电性铜合金材料——弥散强化铜合金。
6) dispersion strengthen
弥散强化
1.
The processes to manufacture dispersion strengthened Cu-TiB_2 composites by in situ methods,such as liquid-solid,solid-solid and liquid- liquid methods,were introduced.
介绍了固-液,固-固,液-液原位复合法制备弥散强化TiB2/Cu复合材料,并归纳总结了弥散强化铜合金的强化机理与导电机制。
2.
With Cu_20 as oxidizer, Al_2O_3 surficial dispersion strengthened copper alloy of various concentration of aluminum were produced by internal oxidation in argon atmosphere(1123-1273 K, 10 - 96 h).
以Cu_2O为氧化剂,在氩气保护下对不同w(Al)的Cu-Al合金表面进行弥散强化(内氧化温度为1123-1273K,保温时间10-96h),并对内氧化层的组织形貌进行了研究。
3.
Al 2O 3 surface dispersion strengthening of Cu-Al alloy was conducted by internal oxidation in argon atmosphere with Cu 2O as oxidizer at 1123K～1273K for 10～96 h.
以Cu2 O为氧化剂,在氩气保护下用内氧化技术对不同低Al含量的Cu Al合金表面进行了弥散强化处理(内氧化温度为112 3～12 73K ,保温时间10～96h) ,研究了硬化层的组织形貌及性能。
补充资料：弥散
弥散
指气体分子通过肺泡、毛细血管膜进行气体交换的过程。供人体交换的肺泡面积多达70m2，相当于人体表面积的40倍。推动气体弥散的动力是膜两侧的分压梯度(分压差)。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条