1) short-nature glass
短性玻璃
2) short flint glass
短性火石玻璃
3) short glass fiber
短玻璃纤维
1.
GF/PP composite was reinforced by alkali short glass fiber,which was prepared by combing injection molding.
采用碱性短玻璃纤维增强PP,通过混合-注塑工艺制备玻璃纤维/PP复合材料,并较全面的研究了玻纤含量、长度、偶联剂类型与加入量对复合材料力学性能的影响。
2.
This experiment has prepared the compound material of fiber reinforced caoutchouc by using the dry compounding process with short glass fiber and C fiber,studied the impacts on tensile strength,elongation at break, tearing strength,Shaoshi strength due to the different fiber type and the addition,as well as compared the property of two kinds of fiber reinforced compound material.
采用了短玻璃纤维及C纤维干法混炼工艺制备了纤维增强天然橡胶复合材料,研究了纤维种类及添加量对其拉伸强度、断裂伸长率、撕裂强度、邵氏硬度的影响,并且就两种纤维增强的复合材料性能进行了对比。
4) short glass fiber
玻璃短纤维
1.
Experimental study on uniaxial time-dependent ratcheting of short glass fiber reinforced polyester resin matrix composites
玻璃短纤维增强树脂基复合材料的单轴时间相关棘轮行为实验研究
2.
The extrusion swelling behavior of the composites systems of chlorinated polyethylene (CPE )and short glass fiber (SGF) which were treated (T type ) or untreated (O type) with silane coupling agent were investigated , and were compared with those of composite system of CPE and glass microsphere (CMS) treated with silane coupling agent .
用毛细管流变仪研究了硅烷改性玻璃短纤维(T型SGF)填充氯化聚乙烯(CPE)复合体系的挤出胀大特性,并与未改性的玻璃短纤维(O型SGF)和硅烷改性的玻璃微珠(GMS)填充的CPE体系进行了比较。
3.
The morphology of capillary extrudate of chlorinated polyethylene (CPE) reinforced by short glass fiber (SGF) composites which were treated (Ttype )or untreated (O type ) with silane coupling agent were investigated by scanning electron micrography .
用扫描电镜研究了硅烷改性玻璃短纤维(T型SGF)填充氯化聚乙烯(CPE)复合体系及未改性玻璃短纤维(O型SGF)充CPE复合体系的毛细管挤出物形态,结果显示出剪切等流动因素对玻璃短纤维(SGF)的取向性和分散性有很大影响;不同SGF复合体系的界面状态不同,SGF分散情况也存在着较大差异;复合材料在毛细管流变仪中均存在着明显的旋转流动。
5) short-flint glass
短火石玻璃
6) Property of glass
玻璃性能
补充资料：半导体玻璃纤维
半导体玻璃纤维
semiconductor glass fibre
半导体玻璃纤维semieonduetor glass fibre表面电阻系数值处于10“一1012见范围的玻璃纤维。用这种玻璃纤维织成的带子称半导体玻璃纤维带，是大中型高压电机的新型防晕材料。20世纪70年代初中国研制成含铜半导体玻璃纤维，其成分包括氧化硅(S 102)、氧化铝(A12O3)、氧化钙(CaO)、氧化镁(MgO)、氧化硼(BZO3)及氧化铜(CuO)，熔化温度在1400oC左右。将这种玻璃纤维制成玻璃纤维带，再在氢气中进行还原热处理，使原成分中氧化铜与氧化亚铜扩散到玻璃带表面，表面层中即出现微晶结构的半导体层。半导体层厚度取决于还原热处理的温度、时间及CuO的含量。控制温度和处理速度，可制得表面电阻系数为1护一1012兑的不同阻值的半导体玻璃纤维带。 采用半导体玻璃纤维不仅使大电机电晕防护措施有较高的可靠性和良好的工艺性，而且减薄了绝缘厚度，提高了热固性绝缘的电气强度，特别是采用整浸型绝缘的防晕措施时，更需要使用半导体玻璃纤维防晕带。(陈伯年)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条