1) semiconductor bonding wafer
半导体接合晶圆
2) Semiconductor Wafer
半导体晶圆
1.
Electroless Ni/Au UBM Process and Equipment For Semiconductor Wafer
半导体晶圆化学镍/金UBM工艺与设备
3) semiconductor chip bonding
半导体晶片焊接
4) semiconductor wafer fabrication system(SWFS)
半导体晶圆制造系统
1.
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system(SWFS),a dynamic bottleneck real-time dispatching(DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性,提出一种动态瓶颈实时派工策略。
2.
According to unique complicated features,this paper proposed a real-time scheduling simulation platform for the semiconductor wafer fabrication system(SWFS) with object-oriented technology.
针对半导体晶圆制造系统(SWFS)的组织构成、加工过程和生产模式的典型特点,以拓展型面向对象Petri网(EOPN)为工具对该复杂系统建立了模型,在准确描述晶圆制造过程的基础上采用面向对象技术设计并开发了一套SWFS实时调度仿真平台。
3.
According to unique features of semiconductor wafer fabrication system(SWFS),such as large scale,multiple re-entrant,and multi-product manufacturing,this paper proposed a new scheduling method by combining decomposition-based method and ant colony optimization(ACO) algorithm.
为了调度具有大规模、多重入、混合型生产等特征的半导体晶圆制造系统,提出一种将基于问题分解的方法与蚁群算法相结合的新的调度方法。
5) semiconductor wafer production line
半导体晶圆生产线
1.
A performance evaluation system,which consists of shortterm performance indices and long-term performance indices,is presented for scheduling semiconductor wafer production line.
针对半导体晶圆生产线调度,提出了由用于日生产计划的调度方案对比的短期性能指标,和用于每日投料计划的、实施分析的长期性能指标组成的半导体晶圆生产制造系统的性能指标体系。
6) 12 inches of Semiconductor Manufacture
12寸半导体晶圆厂
补充资料：的的圆
1.滚圆貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条