Modelling and simulation of vacuum packaging of MEMS devices;

Device level vacuum packaging technologies of MEMS gyroscopes

The vacuum obtains and maintenance is still still the main problem in the field of MEMS vacuum packaging technology.

The former dynamic seal was instead by gasket type seal at the end of flange,so the friction force caused by O-ring rubber seal was reduced,the capability of vacuum seal was im.

Vacuum encapsulation is an important part of silicon micromachined process,the sensitivity and other qualification of micromachine shoud be improved when micromachine apparatus use vacuum encapsulation.

A special structure was designed in order to meet the requirements of vacuum packaging process and to promote and keep high vacuum atmosphere inside the chamber.