1) deserialization
还原序列化
2) deoxidization of edge sequence
边序列还原
1.
Secondly,the geometry feasibility of edge sequences,the deoxidization of edge sequences,the reasoning of part feasible line assembly directions and the predigestion of edge sequences were researched.
分析了传统零件序列表达方法的不足,提出以装配体联系图的各边为序列的表示方法,进而展开对边序列几何可行性分析、边序列还原、零件可行直线装配方向推理及边序列精简的研究;从便于高效自动筛选的角度研究了影响边序列质量的工艺因素(发生冲突的边的个数,稳定性和聚合性的影响,直线装配方向的改变次数),在此基础上建立了边序列的优化目标函数。
3) redox series
氧化还原系列
4) sulfiding and reducing processes
硫化还原工序
1.
The effects of various factors, such as sulfiding time, temperature, sulfiding and reducing processes, H_2S concentration, H_2 concentration, bed expansion rate and so on, on sulfidation were studied.
吡啶-TPD 和XRD 表征结果证明,硫化温度和硫化还原工序,会改变催化剂表面酸性和硫化态活性物种在催化剂表面的聚集状态。
5) reduction sequence
还原顺序
1.
The effect of preparation method,reduction sequence, mole rate of platinum and gold etc for bimetallic nano-clusters was studied.
采用硼氢化钠还原法制得聚乙烯吡咯烷酮(PVP)保护的Pt/Au纳米双金属簇,用TEM、UV-VIS吸收光谱进行了表征,从制备方法、还原顺序、金属不同摩尔比等方面对双金属簇的影响进行了研究。
6) proportion reduction
定比列还原
补充资料：蓝钨氢还原(见仲钨酸铵氢还原)
蓝钨氢还原(见仲钨酸铵氢还原)
hydrogen reduction of blue tung sten compound
Ianwu qing huanyuan蓝钨氮还原(hydrogen reduetion of bluetungsten compound)见仲钨酸按氮还原。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条