1) base metal
被焊料,基焊料
2) Nickel Matrix Solder
镍基焊料
1.
Determination of Phosphorus in Nickel Matrix Solder by ICP-AES;
ICP-AES测定镍基焊料中的磷
3) Tin Solder
锡基焊料
1.
Determination of Stibium in Tin Solder by Flame Atomic Absorption Spectrometry;
火焰原子吸收光谱法测定锡基焊料中锑
4) copper-based solder
铜基焊料
1.
Experiments were made on tungsten and copper using nickel-based solder,copper-based solder,silver-based solder and gold-based solder,the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper.
采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。
5) silver-based solder
银基焊料
1.
Experiments were made on tungsten and copper using nickel-based solder,copper-based solder,silver-based solder and gold-based solder,the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper.
采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。
6) gold-based solder
金基焊料
1.
Experiments were made on tungsten and copper using nickel-based solder,copper-based solder,silver-based solder and gold-based solder,the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper.
采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。
补充资料：2,2'-硫化双(4-叔辛基酚氧基)镍
分子式：
分子量：
CAS号：
性质：见AM-101。
分子量：
CAS号：
性质：见AM-101。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条