1) lower surface grinding width
下侧平面研磨宽度
2) upper surface grinding width
上侧平面研磨宽度
3) grinding width
研磨宽度
4) plane lapping
平面研磨
1.
Research on the uniformity of certain and uncertain eccentricity plane lapping processes;
定偏心和不定偏心平面研磨均匀性的研究
2.
Based on the production practice and aimed at the plane lapping processing technogy and its technology measure for the extra_hard transparent ceramics, the theoretical research was carried out so as to improve the quality in mass production, to reduce cost and to make the material be used more widely.
基于生产实践针对超硬透明陶瓷材料平面研磨加工技术及技术保证措施进行研究 ,以提高批量生产质量、降低成本 ,而使其得到更广泛的应用。
3.
The trace of plane lapping/polishing is reviewed, involving single side and double side lapping/polishing mode.
介绍了平面研磨抛光轨迹均匀性的研究方法,详细阐述了双轴式(包括定偏心式和不定偏心式)、直线式、摇摆式、计算机控制小工具式单面研磨抛光轨迹和行星式双面研磨抛光轨迹的数学函数及其轨迹均匀性,指出了当前轨迹研究中存在的不足。
5) Plane grinding
平面研磨
1.
Modeling and Simulation of Scratches during the Process of Ultra-Precision Plane Grinding;
超精密平面研磨划痕形成的建模与仿真
6) grinding plane
研磨平面
1.
Selection of grinding plane is a key process of making the slice.
研磨平面的选择是头足类耳石制片的最关键步骤,通常选择纵截面研磨。
补充资料：Anglelapping角度研磨
angle lapping 的目的是为了测量junction的深度，所作的芯片前处理，这种采用光线干涉测量的方法就称之angle lapping。公式为xj=λ/2 nf即junction深度等于入射光波长的一半与干涉条纹数之乘积。但渐渐的随着vlsi组件的缩小，准确度及精密度都无法因应。如srp(spreading resistance prqbing)也是应用angle lapping的方法作前处理，采用的方法是以表面植入浓度与阻值的对应关系求出junction的深度，精确度远超过入射光干涉法。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条