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1)  interface between solid and melt
固液体界面
2)  solid/liquid interface
固/液界面
1.
Adsorption mechanism of hyperdispersant on solid/liquid interface;
嵌段型超分散剂在固/液界面的吸附机理
2.
The shape of quenched solid/liquid interface in dendrite growth morphology appears as unevenness where some dendrite trunks grow as convex parts.
在枝晶固/液界面存在枝晶千的凸起,其平-凸-平-凸的程度随抽拉速率的增加呈现先加强后减弱最后几乎消失的规律。
3)  solid/liquid interface
固液界面
1.
Studies on nanobubbles formed at solid/liquid interface;
固液界面纳米气泡的研究
2.
ECSTM and its application in the study of solid/liquid interface;
电化学STM及对固液界面的研究
3.
The evolution of solid/liquid interface during single crystal superalloy growth by seeding technique was investigated.
研究了籽晶法生长单晶高温合金中固液界面的演变规律。
4)  solid-liquid interface
固液界面
1.
Influence of solidification rate on solid-liquid interface in unidirectional solidification microstructure of austenitic stainless steel
凝固速度对奥氏体不锈钢定向凝固组织及其固液界面稳定性的影响
2.
A lattice density functional theory for polymer adsorption at solid-liquid interface presented in this paper may account for the nearest-neighbour interactions and the long-range correlations due to chain connectivity.
提出一个固液界面高分子吸附的格点密度泛函理论。
3.
The adsorption of polydisperse polymers at solid-liquid interfaces is studied by Monte Carlo simulations based on a lattice model.
在格子模型基础上用M onte Carlo方法模拟研究了多分散高分子在固液界面的吸附行为,重点考察了平均分布和正态分布两种不同链长分布形式的高分子在固液界面吸附构型的分布规律。
5)  S/L interface
固液界面
6)  liquid/solid interface
液固界面
1.
The stability of a planar liquid/solid interface of solidification in pure melt under perturbation of a small far-field flow was studied by using asymptotic analysis.
利用渐近分析方法研究在小的远场来流扰动作用下纯熔体内具有液固平直界面的凝固过程的稳定性,导出了液固界面的扰动振幅变化率与波数的色散关系,以此为基础给出了具有液固平直界面的凝固过程的稳定性判据,揭示了金属凝固过程中液固平直界面转变为胞晶界面的内在机理。
2.
The results show that formation of liquid/solid interface with the shape of convex into liquid is the basic condition and the position of the interface is controlled by the stability of experimental condition.
结果表明:形成向液态金属中凸出的液固界面是制备单晶线材的基础,液固界面所处的位置是保证单晶线材质量稳定的关键。
补充资料:液气界面


液气界面


  液体与气体的接触分界处。
  
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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