1) resin-rich mica tape
多树脂云母带
2) resin-rich mica tape
多胶云母带
1.
Thermal conductivity of different kinds of resin-rich mica tape adhesives which were widely used at the present time was studied by guarded heat flow meter technique,and the relationship between thermal conductivity and density by immersion method of the adhesives was also studi.
多胶云母带广泛应用于大型高压电机的主绝缘材料,其导热性直接影响到空冷电机的温升及绝缘的可靠性。
3) mica based resin varnish
云母基树脂漆
4) fluorophlogopite/epoxy resin
氟金云母/环氧树脂
5) mica tape
云母带
1.
Study on F grade mica tape cured by middle temperature was developed;
F级中温固化云母带的研制
2.
Study on application of organic silicone adhesive on fireproof mica tape;
有机硅粘结剂在耐火云母带中的应用研究
3.
A new type curative accelerant for mica tape was studied to degrade the curing temperature and time which is low dielectric loss,low curing temperature,fast curing speed and good insulation property.
为降低F级云母带的固化温度和缩短固化时间,我们对云母带用胶粘剂进行研究,探索了一种新型固化促进剂。
6) mica paper tape
云母带
1.
The curing time of the fast curing mica paper tape is shorter than the TUNG-MA epoxy glass mica paper tape,and it can economize the energy sources and make long development.
快速固化云母带与当前各大电机制造厂应用的普遍桐马环氧玻璃粉云母带相比,模压过程工艺时间短,节能高效,具有一定的发展应用前景。
2.
According to test analyses on the performance such as the gel time,electric strength,dielectric loss coefficient,dielectric loss coefficient-temperature characteristic,shelf life,etc,the influences of JF resin on the curing time of the adhesive and the mica paper tape were researched.
通过对胶粘剂、云母带的成型时间、电气强度、介质损耗因数、介电性能—温度特性、贮存期等性能的测试分析,研究了JF树脂对胶粘剂、云母带固化时间的影响。
补充资料：VHB泡沫胶黏带
分子式：
CAS号：
性质：胶黏带是以丙烯酸闭孔泡沫为基材，其两面涂布压敏胶黏剂，在一面上衬剥离纸构成的双面胶黏带。它有高的剥离强度和剪切强度，耐冲击性好，应力缓和，气密性高，耐候性优良。
CAS号：
性质：胶黏带是以丙烯酸闭孔泡沫为基材，其两面涂布压敏胶黏剂，在一面上衬剥离纸构成的双面胶黏带。它有高的剥离强度和剪切强度，耐冲击性好，应力缓和，气密性高，耐候性优良。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条