1) copper interconnect
铜线互连，铜互连线
2) Cu interconnect
铜互连线
1.
In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.
本论文主要研究了ULSI中铜互连线的微观结构和应力及其对与电徙动MTF的影响。
3) Cu interconnect
铜互连
1.
The effect of via size on the stress migration of Cu interconnects;
通孔尺寸对铜互连应力迁移失效的影响
2.
Studies on the electromigration reliability of Cu interconnects in recent years are reviewed.
综述了近年来铜互连电迁移可靠性的研究进展;讨论了电迁移的基本原理、常用研究方法及主要失效机制;探讨了改善铜互连电迁移性能的各种方法,如铜合金、增加金属覆盖层及等离子体表面处理。
3.
The studies on the electromigration reliability of Cu interconnection are reviewed.
论述了近年来铜互连电迁移可靠性的研究进展,讨论了电迁移的基本原理、失效现象及其相关机制和微效应以及主导失效的机制——界面扩散等,同时探讨了改善铜互连电迁移性能的各种方法,主要有铜合金、增加金属覆盖层及等离子体表面处理等方法,并指出了Cu互连电迁移可靠性研究有待解决的问题。
4) Cu interconnection
铜互连
1.
The Cu interconnection,low-k insulating layer(k<3)between the metal and CMP technology are a standard technology of the high grade IC manufacturing.
铜互连、金属间低k绝缘层(k<3)和CMP工艺已成为制造高端IC的一个标准工艺。
5) copper interconnection
铜互连
1.
The latest researches on bottom-up filling for electroless copper deposition at home and abroad were summarized, including the electroless copper deposition technology applied to copper interconnection of semi- conductor and the formaldehyde-free electroless copper deposition using sodium hypophosphite as reducing agent.
概述了国内外关于超级化学镀铜填充技术的最新研究成果,主要包括应用于半导体铜互连线工艺的化学镀铜和以次磷酸钠作还原剂的无甲醛化学镀铜。
2.
Aiming at the technology demand of advanced copper interconnection,the effect of pulse current density on Cu layer properties such as resistance,crystal size and surface roughness were investigated.
针对先进纳米铜互连技术的要求,研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
3.
The electroplating technology is empl oyed in copper interconnection in ULSI by adding some levelers into the electroplating bath and controlling the electroplating current in three-st ep successfully.
通过对电镀液中加入适当的整平剂和采用三步电流法 ,成功地将工业镀铜技术应用于 UL SI铜互连线技术中 ,实现了对高宽比为 1μm∶ 0 。
6) copper interconnect
铜互连
1.
Effect of addictive in copper interconnect in pulse plating;
添加剂对铜互连线脉冲电镀的影响
2.
Thermo-Elastic Analysis of Air-Gap Copper Interconnects;
Air-gap铜互连结构的热应力分析
3.
Quantitative analysis on median-time-to-fail of copper interconnect with lose object defects
有丢失物缺陷的铜互连线中位寿命的定量研究
补充资料：常州冶炼厂铝线坯连铸连轧生产线
常州冶炼厂铝线坯连铸连轧生产线
常州冶炼厂铝线坯连铸连轧生产线粉
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条