1) sheet backing coat
薄板背衬面层
2) lining board, spear plate, underboarding,lining plate,head block,furring,backing sheet,sheathing board,lining,liner plate,adapter plate
衬板，背衬料
4) Backing sheet
衬背板
5) thin-shit lining
薄板衬里
6) back thinning
背面减薄
1.
As IC chips are fast developing toward higher density, higher performance and smallersize, to meet the demands of IC package, back thinning of the patterned wafer is one of most impor-tant procedure in the backend of semiconductor manufacturing process.
集成电路芯片不断向高密度、高性能和轻薄短小方向发展,为满足IC封装要求,图形硅片的背面减薄成为半导体后半制程中的重要工序。
补充资料：薄板
薄板
sheet
b0Obon薄板(sheet)厚度为0.2一4mm、以单张定尺供应的板材。生产方法主要分为热轧和冷札两类。现代热连轧机生产(见热连札宽带钢生产)的薄板最小厚度为1.Zmm。以叠轧方式热轧(见登札薄板生产)则能生产最小厚度为0.28mm的叠轧薄板。现代冷轧机生产的薄板，厚度更薄(0 .Zmm以下)且尺寸公差更为严格。 (李生智李隆旭)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条