Fractal model for particle-size distribution of coal grinding;

Preparation of γ-Fe_2O_3 Nanoparticles by Solid(wet)-phase Grinding;

The grinding materials and technology for stainless steel;

Rapid detection of subsurface damage of optical materials in lapping process and its influence regularity;

Research on high speed lapping paraboloid workpiece based on bending and forming method;

Research on the Lapping Uniformity of Uncertain Eccentricity Plane Lapping;

Polishing Robot System and the Control of Its Motion;

A new way of polishing is discussed, in which the ultrasonic energy is applied to the interface of mechanical polishing and correlative equipment and experimental equipment are designed.

To improve the material removal rate(MRR),this paper discussed a new ultrasonic polishing in which the ultrasonic energy was introduced to the interface of common polishing,and compared this new polishing process with the common polishing process in the MRR.

Siemens S7-300 PIc In Paper making Grinding Production Line Application;

The applications of the different grinding media in the grind of ink were summarized in this pa- per.

The grind renovation processes of rough grind,fine grind and polishing are analyzed.

Finishing treatment of plating deposit and conversion coating—drawing, rubbing and double-color treatment;

Research on the rubbing technique based on nanometer magnetic liquid

In order to improve machining precision and rubbing efficiency of HIPSN( Hot - Isostatic Pressed Silicon Nitride) ceramic ball and to reduce its rubbing cost, a new rubbing method of ceramic ball, called Taper Rubbing, was developed.