1) moisture difference stress
湿差应力
2) hygroscopic stress
湿应力
1.
In this article the studies on moisture diffusion process, hygroscopic stresses and moisture-induced vapor pressure are reviewed, with the emphasis on the theoretical analysis, parameter characterization and its experimental measurement and validation, as well as the finite element simulation.
微电子塑料封装中常用的聚合物材料因易于吸收周围环境中的湿气而对器件本身的可靠性带来很大影响,本文回顾了封装材料中湿气扩散、湿应力及蒸汽压力的产生这3个互相联系过程的研究情况,从理论分析、特征参数描述及其实验测定、有限元模拟分析的角度来分别予以介绍。
3) absorbing moisture stress
吸湿应力
1.
According to the model of axial symmetry in semi unlimited body, the absorbing moisture stress of adhesion coating under water pressure is studied, which is caused by the difference of absorbing moisture property between filling particulate and adhesion coating basis.
根据半无限体的轴对称模型，对静水压下的胶粘涂层因填充粒子与胶层基体间吸湿性能的差别而引起的吸湿应力进行了研究，以达到饱和吸湿浓度的抗水力磨蚀胶粘涂层为例，对吸湿应力作了数值计算，并进行了结果分
4) humidity stress
湿度应力
1.
Calculating of thermal or humidity stress and architectonics for reinforced concrete rectangular pond;
钢筋混凝土矩形水池温、湿度应力计算与构造设计
2.
In this paper,the author presents forword a new theory in rock mechanics-the humidity stress field the- ory of swelling rock.
本文提出了分析膨胀岩体受水作用的湿度应力场理论。
3.
Using Arrhenius model and Eyring model,the reliability properties of LCD electrode corrosion were studied by corrosion acceleration experiments of LCD electrode with thermal stress & humidity stress,and a typical verifiable LCD life was derived.
利用Arrhenius模型和Eyring模型分析了温度应力和湿度应力对LCD电极腐蚀可靠性的加速影响特性,并根据加速特性推导出典型的可靠性加速试验可验证的产品寿命。
5) hygrothermal stress
湿热应力
1.
Effects of moisture diffusion and hygrothermal stress on reliability of SCSP;
潮湿扩散及湿热应力对叠层封装件可靠性影响
2.
Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering
SiP器件回流焊时湿热应力的分析
3.
Then, thermal stress and hygrothermal stress of lead-free solder joint are simulated and calculated separately, and their performances are analyzed and compared.
文章采用有限元软件分析了潮湿环境下板上倒装芯片下填充料在湿敏感元件实验标准MSL-1条件下(85℃/85%RH、168h)的潮湿扩散分布,进而分别模拟计算出无铅焊点的热应力与湿热应力,并加以分析比较。
6) moisture stress
潮湿应力
补充资料：极限应力平均差
分子式：
CAS号：
性质： 测出的最大作用力偏离平均作用力的值与无应力时试样的截面积之比；单位为Pa。是动态力学加载形式选择上所关心的参数之一。该值愈大，说明所加负载的应力振荡值较大。反之，说明所加交变应力比较平稳。
CAS号：
性质： 测出的最大作用力偏离平均作用力的值与无应力时试样的截面积之比；单位为Pa。是动态力学加载形式选择上所关心的参数之一。该值愈大，说明所加负载的应力振荡值较大。反之，说明所加交变应力比较平稳。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条