1) diaphragm expansion joint
膜片胀缩接合
2) the expansion and the contract of film
底片胀缩
1.
This paper discusses the effect of temperature and relative humidity and studies the methods ofregistration controlling for the PCB production in the expansion and the contract of film and substrates.
文章讨论了温度、湿度对底片胀缩的影响,并结合底片胀缩、单片胀缩的情况探讨了高层数印制板生产对位精度的控制方法。
3) the substrate expansion and thecontract of substrales
单片胀缩
4) expansion joint
膨胀接合
6) expanded joint
胀接，辘口，伸缩缝
补充资料：胀缩宇宙模型
见开放宇宙模型。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条