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1)  metal-bonded diamonds; diamond alloy
金属-金刚石合金
2)  diamond/metal
金刚石/金属
1.
With the rapid development of microelectronic technology,diamond/metal composites as a new generation electronic packaging material have received more and more attention.
随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一。
2.
Due to the good physical properties of diamond,diamond/metal composites as a new generation electronic packaging material receive more and more attention.
由于金刚石的良好物理性能,金刚石/金属复合材料作为新一代电子封装材料受到广泛的重视,是封装材料最有潜力的发展方向之一。
3)  diamond metal matrix
金刚石金属结合剂
1.
Preparation of diamond metal matrix by oxalate Co-precipitation method;
草酸盐共沉淀法制备金刚石金属结合剂
4)  metal-bonded diamond grinding wheel
金属结合剂金刚石砂轮
1.
The principle of electron discharge machining (EDM) dressing based on metal-bonded diamond grinding wheel was introduced and the influential factors to it were analyzed.
简单介绍了铸铁结合剂金刚石砂轮电火花整形的原理,对电火花整形的影响因素进行了分析,为以后金属结合剂金刚石砂轮的电火花整形实验提供了一些经验。
5)  diamond-metal composite film
金刚石-金属复合薄膜
1.
The influence of stirring to the electrodepositing of diamond-metal composite film was discussed in this paper.
给出了搅拌对金刚石-金属复合薄膜电沉积结果的影响,指出:搅拌速度对薄膜中金刚石颗粒密度影响很大, 最佳速度范围内(180r/min-220r/min),金刚石颗粒分布致密;螺旋桨位置严重影响金刚石颗粒分布均匀性,搅拌位置为镀液下部时,可以获得致密均匀的金刚石-金属复合薄膜;阴极倾斜悬挂有利于金刚石颗粒的沉积。
6)  metal bond diamond tools
金属结合剂金刚石工具
1.
This paper investigated the potential application of spray and co-deposition technique in the production of metal bond diamond tools based on their similarity to the particle-reinforced metal matrix composites, and the feasibility of diamond tools prepared by this technique was discussed.
喷射共沉积技术在颗粒增强金属基复合材料的制备中已经有了较为成熟的应用,本文在分析了金属结合剂金刚石工具和颗粒增强金属基复合材料的相似性基础上,研究了利用喷射共沉积技术制备金属结合剂金刚石工具制备的可行性。
补充资料:大理石石渣罩面水磨石,镶嵌大理石片的水磨石
CAS:68038-71-1
中文名称:苏云金芽孢杆菌制剂;苏云金杆菌;大理石石渣罩面水磨石,镶嵌大理石片的水磨石;7216杀虫菌;BT生物农药
英文名称:bacillus thuringiensis;agritol;bacillus thuringensis;bacillus thuringiensis berliner;bactospein;bactur;bakthane;berliner;biotrol;bitoksybacillin;btb 202;dipel
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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