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1)  sulfo-sulfonate
磺基磺酸盐
2)  methylsulfonate
甲基磺酸盐
1.
Application status of methylsulfonate in tin and tin-based alloy plating;
甲基磺酸盐在锡及锡基合金镀层中的应用现状
2.
The features, research progress and application prospect of methylsulfonate bath were introduced particularly.
着重介绍了甲基磺酸盐镀液的特点、研究进展及应用前景,指出了锡铅合金电镀液的发展方向。
3.
The advantage of methylsulfonate tin plating technology was introduced.
介绍了甲基磺酸盐镀锡的工艺优点,综述了甲基磺酸盐镀锡的发展现状及历史。
3)  methanesulfonate
甲基磺酸盐
1.
Study on the synthesis of acetal and ketal with some methanesulfonates as catalyst;
几种甲基磺酸盐催化合成缩醛(酮)的研究
2.
Research progress of additives for acid tin plating in methanesulfonate electrolyte
甲基磺酸盐镀锡添加剂研究进展
3.
The effects of technological parameters,such as the dosages of main salts and methanesulfonic acid,current density,temperature and stirring rate on the electroplating of Sn-Pb alloy in a methanesulfonate electrolyte were discussed.
讨论了主盐、甲基磺酸用量,电流密度,温度,搅拌速率等工艺参数对甲基磺酸盐电镀锡铅合金的影响。
4)  sulphamate ['sʌlfəmeit]
氨基磺酸盐
1.
Thus sulphamate electroplating technology was used to prepare nickel coating for the repair of the airplane parts.
氨基磺酸盐电镀镍工艺镀层内应力小、沉积速度快,且具有较好的结合力,可以很好地应用于飞机零件维修。
2.
Influence factors on internal stress of sulphamate NiFe alloy coating were approached experimentally.
实验探讨了氨基磺酸盐电沉积Ni-Fe合金层内应力的影响因素。
3.
In this paper,polarization behavior of electrodeposition of lead--cadmium and their alloys was studied in thesystem of sulphamate.
本文研究了氨基磺酸盐体系电沉积铅镉及其合金的极化行为,测定了在不同温度、搅拌、添加剂等因素对单金属镀液和混合镀液的极化曲线,表明添加剂间苯二酚对电沉积铅的极化影响较大,可实现铅镉共沉积的目的,初步研究了不同电流对合金镀层成分的影响。
5)  Sulfamate
氨基磺酸盐
1.
Study on synthesis and property of modified sulfamate superplasticizer;
改性氨基磺酸盐系高效减水剂的合成与性能研究
2.
Microstructure and texture in nickel shaped charge liner prapared by electroformation from sulfamate
氨基磺酸盐电铸镍药型罩的制备与微观组织
3.
The anodic behavior of electrolytic nickel anode in nickel sulfamate plating Solution was investigated,using anodic polarization curves,metallographic observation of cross-sections of nickel deposits,Hull Cell tests with solutions with and without Cl-,F-,bending tests with five solutions of different compositions,and sulfur content analysis in nickel deposit with mass spectrometry.
采用极化曲线、金相观察、赫尔槽电镀试验、弯曲试验和质谱分析方法,研究了氨基磺酸盐镀镍的阳极行为,证明了当在氨基磺酸盐镀液中使用电解镍阳极时,其活化峰值电流和镀液组成有很大的相关性,当镀液中不含F-和Cl-时其阳极活化峰值电流小,阳极处于极化状态,或相当大面积处于极化状态,使氨基磺酸根在极化的阳极表面氧化,从而使含硫化合物夹附于镀镍层,形成镀层内应力,并使镀层成为层状结构,并出现半光亮的外观。
6)  aminosulfonate
氨基磺酸盐
1.
Continuous, high speed and selective nickel plating on discrete parts in aminosulfonate bath;
分立器件连续高速选择氨基磺酸盐镀镍工艺
补充资料:二甲基甲氧基苯基呋喃甲基磺酸基苯基二胺甲基磺酸盐
CAS:55911-29-0
分子式:C19H19N2O4S·CH3O4S
中文名称:二甲基甲氧基苯基呋喃甲基磺酸基苯基二胺甲基磺酸盐

英文名称:Methyl sulfate salt of N,N-dimethyl methoxybenzofuranyl methylsulfonyl benzimidizole

1h-benzimidazolium, 2-(6-methoxy-2-benzofuranyl)-1,3-dimethyl-5-(methylsulfonyl

2-(6-methoxy-2-benzofuranyl)-1,3-dimethyl-5-(methylsulfonyl)-1h-benzimidazoliu methylsulfate
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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