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1)  Methanesulfonic acid,lead(2+)salt
甲磺酸铅盐
2)  Lead methane sulfonate
甲磺酸铅
3)  Formic acid,leadsalt
甲酸铅盐
4)  Lead methanesulfonate
甲基磺酸铅
5)  methylsulfonate
甲基磺酸盐
1.
Application status of methylsulfonate in tin and tin-based alloy plating;
甲基磺酸盐在锡及锡基合金镀层中的应用现状
2.
The features, research progress and application prospect of methylsulfonate bath were introduced particularly.
着重介绍了甲基磺酸盐镀液的特点、研究进展及应用前景,指出了锡铅合金电镀液的发展方向。
3.
The advantage of methylsulfonate tin plating technology was introduced.
介绍了甲基磺酸盐镀锡的工艺优点,综述了甲基磺酸盐镀锡的发展现状及历史。
6)  methanesulfonate
甲基磺酸盐
1.
Study on the synthesis of acetal and ketal with some methanesulfonates as catalyst;
几种甲基磺酸盐催化合成缩醛(酮)的研究
2.
Research progress of additives for acid tin plating in methanesulfonate electrolyte
甲基磺酸盐镀锡添加剂研究进展
3.
The effects of technological parameters,such as the dosages of main salts and methanesulfonic acid,current density,temperature and stirring rate on the electroplating of Sn-Pb alloy in a methanesulfonate electrolyte were discussed.
讨论了主盐、甲基磺酸用量,电流密度,温度,搅拌速率等工艺参数对甲基磺酸盐电镀锡铅合金的影响。
补充资料:甲磺酸铅盐
CAS: 17570-76-2
分子式: C2H6O6PbS2
分子量: 397.3858
中文名称: 甲磺酸铅盐;甲基磺酸铅;甲磺酸铅

英文名称: Methanesulfonic acid, lead(2+) salt;lead methanesulfonate;Lead methane sulfonate;Methanesulfonic acid,lead(2+)salt

性质:无色透明液体,有腐鸡蛋味,比重1.65。

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