1) triethylphenylsilane
三乙基苯基硅烷
2) ethyltriphenylsilane
乙基三苯基硅烷
3) Phenylethyl trichlorosilane
苯乙基三氯硅烷
4) styrenyltriehoxysilane
苯乙基三乙氧基硅烷
5) methyl-tri(phenylethynyl)silane
甲基三苯乙炔基硅烷
1.
Two high temperature resistant silicone resin,methyl-di(phenylethynyl)silane and methyl-tri(phenylethynyl)silane were synthesized by the reaction of phenylacetylide,methyldichlorosilane and methyltrichlorosilane in the presence of lithium.
以苯乙炔与甲基二氯硅烷、甲基三氯硅烷在有机锂试剂中反应,合成了甲基二苯乙炔基硅烷(MD-PES)和甲基三苯乙炔基硅烷(MTPES)2种新型耐高温有机硅树脂。
6) phenyltriethoxysilane
苯基三乙氧基硅烷
1.
Phenyl silicones were prepared by acid-catalyzed controlled hydrolytic polycondensation of phenyltriethoxysilane, diphenyldimethoxysilane and dimethyldiethoxysilane.
以苯基三乙氧基硅烷(PTES)、二苯基二甲氧基硅烷(DPDS)和二甲基二乙氧基硅烷(DMDS)为单体,在0·1mol/L的稀盐酸催化下水解缩聚成具有阻燃性能的高苯基含量的硅树脂,采用TGA和DSC对PTES/DPDS/DMDS投料摩尔比为75·0/18·8/6·2的高阻燃性产物的热力学性能进行了表征。
2.
A series of phenyl silicone fluid with different adhesion propertieswere successfully synthesized from hexamethyldisiloxane(MM) and phenyltriethoxysilane [PhSi(OEt)3].
以六甲基二硅氧烷(MM)和苯基三乙氧基硅烷[PhSi(OC2H5)3]为原料,合成了一系列不同黏度的苯基硅油。
3.
Organosilicon resin microparticles with phenyl and aminopropyl groups were prepared via the hydrolytic co-condensation of phenyltriethoxysilane(PTES),γ-aminopropyltriethoxysilane(APS) and diphenyldimethoxysilane(DDS) under the catalysis of tetramethylammonium hydroxide (TMAOH ).
在四甲基氢氧化铵(TMAOH)水溶液的催化作用下,将苯基三乙氧基硅烷(PTES)、γ-氨丙基三乙氧基硅烷(APS)和二苯基二甲氧基硅烷(DDS)进行水解共缩聚制备氨丙基苯基有机硅树脂微粉。
补充资料：三乙基苯基硅烷
分子式：(C2H5)3SiC6H5
CAS号：
性质：沸点239℃。相对密度0.9060。浓硫酸作用下，分了内的Si-C6H5键断裂，生成[(C2H5)3Si]2SO4和苯。300℃连续加热4天后，发生重排反应，生成四乙基硅烷和二苯基二乙基硅烷。可由三乙基氯硅烷与苯基溴化镁反应来制取。
CAS号：
性质：沸点239℃。相对密度0.9060。浓硫酸作用下，分了内的Si-C6H5键断裂，生成[(C2H5)3Si]2SO4和苯。300℃连续加热4天后，发生重排反应，生成四乙基硅烷和二苯基二乙基硅烷。可由三乙基氯硅烷与苯基溴化镁反应来制取。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条