1) thin circular plates
圆形薄片
2) circle piezoelectric thin film
圆形压电薄膜片
3) cylinder flaker
圆筒形薄木片切削机
4) circle slice
圆薄片
5) Wafer thinning
圆片减薄
6) ultrathin wafer
超薄圆片
1.
The ultrathin wafer sawing technology, which is the key and basic technology to small outline IC, is becoming more and more important, as it directly affects the product quality and reliability.
集成电路小型化正在推动圆片向更薄的方向发展,超薄圆片的划片技术作为集成电路封装小型化的关键基础工艺技术,显得越来越重要,它直接影响产品质量和寿命。
