1) thermal interface
热界面
1.
This paper presents the application of a hybrid neural network model denoted as GRNNFA for predicting the height of the thermal interface between the hot and cold gases layers in a single compartment fire.
本文提出了一种混合式神经网络模型(GRNNFA)用于预测单个空间内火灾中的热烟气层与冷气层之间热界面的高度。
2) interface thermal resistance
界面热阻
1.
This paper introduces the main steps of the emulation of low-temperature interface thermal resistance between Al and Al with the method of non-equilibrium molecular dynamics, makes comparison of and analysis on the emulating results and experimental results, and points out the reasons of the errors.
介绍了用非平衡态分子动力学对低温Al与Al之间界面热阻仿真的主要步骤,并对仿真结果与实验结果进行了比较分析,指出了出现误差的原因。
2.
It is found that the thermal conductivity and the proportion of interface thermal resistance to total thermal resistance have no relation with the number of periods for the superlattice structure with a fixed period length.
模拟结果显示 ,周期长度固定的超晶格薄膜 ,界面热阻在总热阻中的比例和导热系数同周期数无关 ;当超晶格薄膜的膜厚不变时 ,导热系数将随着周期长度的增大而增大 ,但由于超晶格薄膜晶格常数的不匹配 ,使其内部发生明显的几何形变 ,这种变化关系也愈加复杂 ,同时周期长度的增加 ,平均界面热阻也随着增大 ,揭示了界面热阻不仅取决于界面层的物理条件 ,而且也与构成的介质内部形变有着重要关
3.
The interface thermal resistance was the basic science problem in the fields of cryogenics,aerospace,superconducting and microelectronic technology etc.
固体界面热阻是航空航天、低温与超导、微电子技术等领域中研究热点问题,氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。
3) interfacial thermal resistance
界面热阻
1.
Experiment research shows that efficiently controlling interfacial thermal resistance in cryocooler-cooled high Tc SMES unit should be a key technical problem bes.
在实验研究超导磁体降温特性的基础上,对SMES磁体的冷却过程进行了热分析,实验研究表明为使超导磁体有效地冷却和稳定运行,除了减小磁体漏热和其内部发热,有效控制热传导部件间的接触界面热阻是高温超导直接冷却磁储能装置研发应用中的关键技术问题。
4) thermal boundary resistance
界面热阻
1.
Investigation on the mathematic model of thermal boundary resistance for thin-film high-T_c superconductors based on the peeling stress;
基于热应力的高温超导薄膜界面热阻模型研究
2.
The influence of thermal boundary resistance on thermal conductivity of composite material is discussed in particular.
研究了金刚石／银复合材料的导热率与金刚石的含量、粒度等之间的关系，着重讨论了界面热阻对复合材料导热率的影响。
3.
In view of relating to the heat analyses calculation, design and making of the aerospace devices, the thermal boundary resistance becomes the key problem of thermal control technique in aerospace.
在航空航天领域,固体界面热阻是航天器热控技术中普遍存在和必须解决的分析计算与设计制造问题。
5) thermal contact resistance
界面热阻
1.
The Experimentation and Research on Thermal Contact Resistance of LSI;
大规模集成电路界面热阻试验研究
2.
985 MPa), thermal contact resistance of AlN/OFHC-Cu decrease with a increasing contact pressure, and with a increasing contact temperature by the intensive movement of heat carrier.
用低温真空实验装置稳态导热法,实验研究了界面温度和接触压力对氮化铝(AlN)与无氧铜(OFHC Cu)间接触界面热阻的影响。
3.
This paper is researched and discussed elementarily on thermal contact resistance of LSI.
以一款CPU与散热器的界面热阻作为研究对象进行初步的试验研究和探讨。
6) Interface of heat transfer
传热界面
补充资料：负温度系数热敏电阻陶瓷(见热敏陶瓷)
负温度系数热敏电阻陶瓷(见热敏陶瓷)
thermo-sensitive ceramics with negative temperature coefficient
负温度系数热敏电阻陶瓷thermo一sensitiveeeramies with negative temperature eoeffieient在某一特定温度范围，电阻率随温度的升高而明显减小的热敏陶瓷。简称NTC陶瓷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条