1) void closing
孔洞锻合
1.
With help of FE software Deform 3D, the rigid-plastic FE models for simulating the M-shape anvil upsetting and inner void closing process have been setup, the simulation results showed that the center of the forge piece was in three-dimensional compression stresses state which was helpful to improve the.
本文针对大型锻件镦粗过程的金属变形特点,介绍了一种能够缩小锻件难变形区的“M形板”镦粗方法——M锻造法,并利用大型商用有限元软件Deform 3D建立了M锻造法镦粗过程的刚塑性有限元模型,对锻件内部孔洞锻合过程进行数值模拟,结果表明锻件内部应力状态良好,并能有效锻合锻件心部及难变形区域内孔洞型缺陷。
2) stitch hole
缝合孔洞
1.
The effect of stitch holes on stiffness of laminates is taken into consideration.
提出了缝合复合材料层板的刚度预报模型,该模型考虑了缝合针脚处的孔洞对刚度的影响,描述了缝合孔洞的几何形态,建立了孔洞形态与纤维弯曲的关系,采用平均刚度法和经典层合板理论进行了刚度预报,获得了与试验数据相吻合的预报结果,表明了该模型的有效性,详细探讨了缝合孔洞对缝合层板刚度的影响规律,得到一些有益结论。
3) closing the hole
孔洞闭合
1.
The effects of friction condition on closing the hole has also been investigated.
采用刚塑性有限元法对镦粗过程中的圆柱锻件内孔洞缺陷进行了数值分析，并研究了摩擦条件对锻件内孔洞闭合的影响。
5) microvoid coalescence
微孔洞聚合
6) close-up ratio
孔洞弥合率
1.
The diffusion holes close-up ration and fracture were investigated by means of optical metallographic microscope,scanning electron microscope.
结果表明:氢元素能够显著提高扩散连接界面孔洞弥合率;随着连接温度的升高、连接时间的延长以及连接压力的增大,界面孔洞逐渐减少;当连接温度T=875℃,保温时间t=60min,焊接压力P=5MPa时,实现置氢Ti600的良好扩散结合,界面扩散孔洞消失;接头室温拉伸强度达1013MPa,为等条件下母材强度的96%,断口呈明显韧窝形貌。
补充资料：表光合强度(见光合强度)
表光合强度(见光合强度)
forecast of sowing or transplanting time
b iaoguanghe qiangdu表光合强度见光合强度
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条