说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 词典 -> 继承与封装
1)  Inheritance and Encapsulation
继承与封装
2)  the encapsulating and inheriting of type
类的封装和继承
1.
In accordance with the designing mode and the designing guidelines, this system has adopted the assembling mode from among the twenty-three modes, and at the same time has made use of the encapsulating and inheriting of type to finish the definition of the interface.
本系统主要依据软件工程的设计模式和设计思想,采用了二十三种设计模式中的聚合模式,同时使用了类的封装和继承来完成接口的定义,应用线程间的同步技术,主要采用四种线程同步方式中的事件来实现线程同步的。
3)  class and inheritance
类与继承
4)  Inheritance and Innovation
继承与创新
1.
Brief Discussion on the Inheritance and Innovation of the Enterprise Culture;
浅谈企业文化的继承与创新
2.
On the basis of Inheritance and Innovation,through the research of the methods,packing up the literature,the amalgamation of many subjects,absorbing the research technology of modern molecule and biology medicine,and so on,we constructed the method system of TCM Modernization step by step.
文章认为,对中医学的研究要遵循其自身发展规律,应在继承与创新的基础上,通过方法论的研究、整理文献、多学科共融、吸纳现代医学分子生物学研究技术等方法,逐步构建中医现代化的方法体系。
3.
To explore the way to the integration of Chinese and western medicine in the inheritance and innovation of traditional Chinese medicine, thi s article analyzes its intrinsic motive force and developmental trend and adopts modern scientific techniques to develop Chinese medical theory in a unique, ori ginal and differential thinking method.
探讨中医学发展进程中继承与创新的结合方法。
5)  inheritance and development
继承与发展
1.
Study on the inheritance and development principle of the tradition building culture in the modern interior design;
传统建筑文化在现代室内设计中的继承与发展的原则研究
2.
On the inheritance and development of the spirit of New Literature of May 4th Movement ——discussing the thought of Zhou Wen on popularization of literature
对“五四”新文学精神的继承与发展——论周文的文艺大众化思想
3.
The relationship between inheritance and development displays the further understanding of the reform rules and tendency by the contemporary Communist Party of China.
这种继承与发展关系,体现着当代中国共产党人对改革规律、趋势认识的进一步深化。
6)  succession and stickness
继承与坚持
补充资料:Assembly晶粒封装

以树酯或陶瓷材料,将晶粒包在其中,以达到保护晶粒,隔绝环境污染的目的,而此一连串的加工过程,即称为晶粒封装(assembly)。封装的材料不同,其封装的作法亦不同,本公司几乎都是以树酯材料作晶粒的封装,制程包括:芯片切割→晶粒目检→晶粒上「架」(导线架,即lead frame)→焊线→模压封装→稳定烘烤(使树酯物性稳定)→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic,通常用于消费性产品,如计算机、计算器,而以陶瓷作封装材料之ic,属于高性赖度之组件,通常用于飞弹、火箭等较精密的产品上。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条