1) the tin concentration
渗锡量
2) tin penetration
渗锡
1.
Using a special mini-graphite tin bath to simulate the float process of float borosilicate glass,the tin penetration profiles in different temperature area from 1 250 ℃ to 650 ℃ were studied by EPMA/EDS.
根据实验样品的成分,制定一定的浮法成型的温度制度,采用自制小型石墨锡槽,模拟硼硅酸盐玻璃的浮法成型过程,用电子探针结合能谱仪,测试浮法硼硅酸盐玻璃在1250~650℃温度范围内不同温度段下表面渗锡的分布情况,研究硼硅酸盐玻璃不同于传统钠钙硅浮法玻璃的渗锡特点。
2.
A mathematical model with initial and boundary conditions for the tin penetration was built and discussed.
利用数值模拟技术对浮法玻璃渗锡过程进行了研究 ,给出了浮法玻璃渗锡过程的数学模型以及边界条件 ,并对渗锡过程进行了初步的模拟 ,模拟结果的变化趋势同实际生产中的变化趋势基本一
3.
The characteristics of tin penetration,tin distribution,chemical composition and physical properties variation in the surface layer of float glass were described as viewed from the forming process of float glass.
从浮法玻璃成形工艺的特点出发,论述了浮法玻璃表面渗锡以及渗锡分布特征,浮法玻璃表面化学成分的变化特征,浮法玻璃表面物理性质的变化特征。
4) stanizing
渗锡处理
5) Trace Tin
痕量锡
1.
Determination of Trace Tin in Seawater by Hydride Generation-Atomic Fluorescence Spectrometry;
氢化物发生-原子荧光光谱法测定海水中的痕量锡
2.
Determination of Trace Tin in Unplastized Polyvinyl Chloride Pipes for Drinking Water Supply by GFAAS;
石墨炉原子吸收光谱法测定硬聚氯乙烯饮水管中痕量锡
3.
Study on Catalytic Spectrophotometric Determination of Trace Tin with H 3PO 4 RhB H 2O 2 System;
H_3PO_4-RhB-H_2O_2体系催化分光光度法测定痕量锡的研究
6) tin content
锡含量
1.
Continuous determination of copper and tin content in Cu-Sn alloy electroplating bath;
铜锡合金电镀液中铜、锡含量的测定
2.
In this article,the tin content of coating was measured by a kind of coulometry method,and found that thiourea was the main driving force tin deposition,rather than sodium hypophosphite by the study of the effect of sodium hypophosphite on the tin deposition.
本文采用电量法对镀层锡含量进行测定,通过研究NaH_2PO_2对镀层锡沉积量的影响,发现硫脲(TU)是锡沉积的主要推动力,而不是NaH_2PO_2。
补充资料：渗渗
1.寒冷貌。 2.指因害怕而产生发冷的感觉。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条