1) point reliability
点可靠性
2) solder joint reliability
焊点可靠性
1.
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis.
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。
2.
With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。
3) Reliability of solder joints
焊点可靠性
1.
Because of the high integration level of electronic packaging, evaluating solder joints reliability is more and more difficult, and lead-free packaging also bring new problems to the research on reliability of solder joints.
电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又给焊点可靠性研究带来新的问题。
4) two-terminal reliability
2-终点可靠性
1.
A recursive algorithm is presented to calculate two-terminal reliability of k-ary n-tree.
该文提出计算k元n树的2-终点可靠性的递归算法,其计算复杂度为O(n)。
5) probability of node reliability
点可靠性概率
6) analysis of reliability
起算点可靠性分析
补充资料：必然性，可靠性
必然性，可靠性
certainty
必然性，可靠性[沈r侧nty;月oeToaep毗T‘] 预先确信某事件毫无疑问会实现.必然性是某事件可实现性的特征，且标上了最高水平的概率.在概率论中，必然性的概念是与必然事件(certain event)和以概率l出现的事件相联系的.在实践中，只要某事件的概率充分接近于1，人们就称之为必然性事件.
说明：补充资料仅用于学习参考，请勿用于其它任何用途。