1) phase interface bonding strength
相界面结合力
2) interfacial binding force
界面结合力
1.
The interfacial binding forces among the plant fibers and the basalt fibers were theoretically explained to be the binding forces of the hydrogen bonds between the molecules of fibers, the hydrogen bonds between the molecules of agents and fibers as well as the meshwork binding forces of agent's macromolecules am.
植物纤维与玄武岩纤维之间的界面结合力为纤维之间的氢键结合力、纤维与助剂分子之间的氢键结合力、助剂大分子在纤维之间的"网络连接"作用力等。
2.
The type of interfacial binding force was discussed in this paper, and formation process of bonding strength during wood gluing operation was also discussed.
简要概述了界面结合力的类型以及木材胶接操作过程中胶合强度的形成过程。
3) Interface adhesive strength
界面结合能力
4) interfacial bonding
界面结合
1.
The reason is believed to be the improved interfacial bonding.
研究表明，在碳化硅复合材料表面化学镀一层镍，能够较好地改善增强体与基体的界面结合，使得碳化硅复合材料的抗弯强度、冲击韧性及宏观硬度均有了明显的提高。
2.
The fracture surface of the wires studied by scanning electron microscopy (SEM) shows a suitable interfacial bonding between the fiber and aluminum.
复合丝拉伸断口的扫描电镜（ＳＥＭ） 观察可见断面有一定起伏，部分纤维拔出但长度较短，表明纤维与基体具有适当的界面结合。
3.
Al/Diamond composites were fabricated by Spark Plasma Sintering(SPS) under Solid-phase sintering,changes of interfacial bonding during sintering process were investigated mainly.
使用放电等离子烧结(SPS)固相烧结条件下制备Al/Diamond复合材料,重点研究烧结过程中基体与增强体两相界面结合状态随烧结时间的变化规律。
5) interface
[英]['ɪntəfeɪs] [美]['ɪntɚ'fes]
结合界面
1.
The interface between Ga_(95.
15Sn合金与Cu基体的结合界面进行了分析。
6) bonding interface
结合界面
1.
Bonding ability of TA2 and 316L plates with explosion cladding was evaluated,the microstructure and composition of the bonding interface was investigated by SEM,EDS and XRD.
结果表明,结合区形貌呈波状,结合界面附近形成细晶区;结合区存在不连续的熔合层,该层含有大量金属基体小碎块和合金化后生成的金属间化合物,并产生了裂纹、气孔,且波状结合界面不同位置组织成分分布不均匀等焊接缺陷;两基板之间发生了元素扩散;拉剪实验各项性能满足复合材料使用要求,拉伸后波状界面发生了分离。
2.
(1)We have found and defined three kinds of bonding interfaces:big wavy,small wavy and micro wavy,and the micro wavy interface is the best,in a cladding plate,it is for the first time to find that the form of interface presents regular distribution.
爆炸焊接理论与技术取得了四个方面的进展:(1)发现并重新定义了三种结合界面:大波状、小波状和微波状,其中以微波状为最佳。
3.
The bonding interface of TA1/Q235 and the diffusion of Ti and Fe are investigated by the manufacture of TA1/Q235 with ARB process.
通过TA1/Q235的累积叠轧焊,研究TA1/Q235复合板结合界面组织和Ti与Fe两元素的扩散情况。
补充资料：镀层结合力
分子式：
CAS号：
性质：电镀层与基体表面的结合强度。评定的方法有摩擦抛光试验、剥离试验、锉刀试验、凿子试验、划线划格试验、弯曲试验、缠绕试验、拉力试验、阴极试验、喷丸试验等。定量测定的方法比较复杂，故常采用定性评定方法。
CAS号：
性质：电镀层与基体表面的结合强度。评定的方法有摩擦抛光试验、剥离试验、锉刀试验、凿子试验、划线划格试验、弯曲试验、缠绕试验、拉力试验、阴极试验、喷丸试验等。定量测定的方法比较复杂，故常采用定性评定方法。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条