1) sulphur wraps
硫包裹
1.
The leaching rate of copper was not high in leaching copper sulphide concentrate under the general temperature because the massive sulphur wraps formed during the leaching process.
中温浸取硫化铜精矿浸出率低的主要原因是形成大量的硫包裹,通过在浸出液中加入氯离子,可使精矿中铜浸出率达到96%以上,通过研究氯离子存在条件下硫包裹的形成机理得出:氯离子使硫包裹的结构发生根本的变化,从而有利于铜的溶出,也有利于硫的回收。
2) encapsulation of sulfur
硫的包裹
1.
It proves the effect of encapsulation of sulfur on zinc dissolution through contrast experiments,and explores initially the mechanism of the effect of sodium lignosulfonate on zinc dissolution,and the dose of sodium lignosulfonate under the premise of the high zinc dissolution rate.
硫的包裹是影响锌浸出率的重要因素。
3) coated gold in pyrites
硫铁矿包裹金
4) encapsulation
[英][in,kæpsju'leiʃən] [美][ɪn,kæpsə'leʃən]
包裹
1.
NanoSolve-a new type of technique for the encapsulation of lipophilic actives;
NanoSolve——一种包裹亲油性活性物的新技术
2.
Modified hyperbranched and linear polyethylenimine (PEI) as nano-sized inverted micelles for the encapsulation and release of polar guest molecules was comparatively studied.
本论文对比性地研究了改性后的超支化及线性聚乙烯亚胺(PEI)作为反相纳米胶束对极性客体分子的包裹及释放行为。
3.
The effect of paraffin oil content,emulsifier content,and the content of the first phase on the stability of paraffin oil W/O/W multiple emulsion was studied by determining the encapsulation of Vitamin-C.
选用低温稳定性较好的W/O/W型多重乳液包裹易被氧化的维生素C。
5) enwrap
[英][in'ræp] [美][ɪn'ræp]
包裹
1.
The choice of surfactant and the conditions of enwrapping on preparation of magnetic fluid;
磁流体制备中表面活性剂的选择及其包裹条件的影响
2.
The XRD spectra,FT-IR spectra and magnetic characteristic show that the enwrapping of Co_3O_4() .
X-射线衍射(XRD)、红外光谱(IR)及磁性能测定表明,聚苯乙烯对Co3O4纳米粒子的包裹是成功的。
6) coating
[英]['kəʊtɪŋ] [美]['kotɪŋ]
包裹
1.
Studies on Preparation of PbNb_2O_6 Micropowder by Liquid-Phase Coating on Solid Particles Method;
液相颗粒包裹法制备PbNb_2O_6微粉的研究
2.
Investigation on Properties of Al_2O_3 / Cu Composite Prepared by Liquid-coating and Hot-pressing Method;
包裹和热压制备Al_2O_3/Cu复合材料及性能研究
3.
Cu coated SiC composite powders were made by the heterogeneous precipitation coating method and the hot pressing process was used to prepare SiCp/Cu composites with 20%-65%SiC particles.
采用非均相沉淀包裹法制得铜包SiC复合粉体,利用热压烧结工艺制备了含有体积分数为20%~65%SiC颗粒的SiCp/Cu复合材料。
补充资料：5-硫基-3-苯基-2-硫-1,3,4-硫代二唑,钾盐
CAS: 17654-88-5
分子式: C8H6N2S3
中文名称: 铋试剂II；3-苯基-1,3,4-噻二唑亚基-2,5-二硫酮；5-硫基-3-苯基-2-硫-1,3,4-硫代二唑,钾盐；铋试剂 II
英文名称: BismuthiolII；5-Mercapto-3-phenyl-2-thio-1,3,4-thiodiazole, potassium salt；4-thiadiazole-2-thione, 5-mercapto-3-phenyl-2h-3；4-thiadiazolidine-2,5-dithione, 3-phenyl-3；3-phenylbismuthol；5-mercapto-3-phenyl-2h-1,3,4-thiadiazole-2-thione；3,4-Thiadiazolidine-2,5-dithione, 3-phenyl-1
分子式: C8H6N2S3
中文名称: 铋试剂II；3-苯基-1,3,4-噻二唑亚基-2,5-二硫酮；5-硫基-3-苯基-2-硫-1,3,4-硫代二唑,钾盐；铋试剂 II
英文名称: BismuthiolII；5-Mercapto-3-phenyl-2-thio-1,3,4-thiodiazole, potassium salt；4-thiadiazole-2-thione, 5-mercapto-3-phenyl-2h-3；4-thiadiazolidine-2,5-dithione, 3-phenyl-3；3-phenylbismuthol；5-mercapto-3-phenyl-2h-1,3,4-thiadiazole-2-thione；3,4-Thiadiazolidine-2,5-dithione, 3-phenyl-1
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条