1) macropore array
大孔深通道阵列
2) deep macropore array
深孔列阵
3) via holes array
通孔阵列
1.
To integrate MMIC chips into LTCC substrates,a passive structure of the LNA including bonding wires,via holes array and multilayer ground planes is designed and optimized using 3D full-wave electromagnetic software,the bonding wires are used for interconnection from MMIC chips to microstrip lines and the via holes array are used for grounding between different ground planes.
将低噪声放大器的MMIC芯片集成于LTCC基板中,利用三维全波电磁场软件设计和优化了LNA的无源模型,包括金丝、通孔阵列和多层地平面。
4) multiple array channel
多阵列通道
5) Two channel array
双通道阵列
补充资料：深通
1.精通。
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