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1)  diamond/metal
金刚石/金属
1.
With the rapid development of microelectronic technology,diamond/metal composites as a new generation electronic packaging material have received more and more attention.
随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一。
2.
Due to the good physical properties of diamond,diamond/metal composites as a new generation electronic packaging material receive more and more attention.
由于金刚石的良好物理性能,金刚石/金属复合材料作为新一代电子封装材料受到广泛的重视,是封装材料最有潜力的发展方向之一。
2)  metal-bonded diamonds; diamond alloy
金属-金刚石合金
3)  metal-coated diamond abrasive
金属镀覆金刚石
1.
This paper firstly studied the bonding mechanism of the photosensitive resin blade,and then introduced the effective measures to improve the quality for photosensitive resin blade by means of the metal-coated diamond abrasive and studied the change of bonding ability of the blade compared with conventional abrasive.
首次在光固化树脂结合剂锯片中引进几种金属镀覆的金刚石磨料,通过对不同半导体材料进行切割试验,证实了在光固化树脂结合剂锯片中采用金属镀覆金刚石磨料后,针对单晶硅、铌酸锂、陶瓷等半导体材料,几种不同锯片的磨损率分别降低了25%~200%、12。
4)  diamond metalwork
金刚石金属制品
1.
The diamond metalwork was made by the physically metallurgy on metallization of diamond surface and then powder metallurgical sinterprocess.
利用JCXA-733型电子探针显微分析仪,分析金刚石表面金属化的某些物理特性,研究了金刚石金属制品的断口形貌,以及金刚石与金属胎体间的微观组织结构和成分。
5)  metal clad diamond
金属衣金刚石
6)  diamond metal matrix
金刚石金属结合剂
1.
Preparation of diamond metal matrix by oxalate Co-precipitation method;
草酸盐共沉淀法制备金刚石金属结合剂
补充资料:大理石石渣罩面水磨石,镶嵌大理石片的水磨石
CAS:68038-71-1
中文名称:苏云金芽孢杆菌制剂;苏云金杆菌;大理石石渣罩面水磨石,镶嵌大理石片的水磨石;7216杀虫菌;BT生物农药
英文名称:bacillus thuringiensis;agritol;bacillus thuringensis;bacillus thuringiensis berliner;bactospein;bactur;bakthane;berliner;biotrol;bitoksybacillin;btb 202;dipel
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